Industry News: bare bake (Page 1 of 1)

IPC Delivers New Standard on Handling, Packaging and Storage of Printed Boards

Industry News | 2010-09-13 15:36:15.0

IPC — Association Connecting Electronics Industries® has released IPC-1601, Printed Board Handling and Storage Guidelines. The industry's sole standard on the handling, packaging and storage of printed boards, IPC-1601 provides users with guidance on how to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake.

Association Connecting Electronics Industries (IPC)

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Industry News | 2018-12-08 03:29:29.0

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Flason Electronic Co.,limited

SMART Group to Host Moisture-Sensitive Components/PCB Handling Workshop

Industry News | 2011-12-30 23:20:54.0

SMART Group, Europe’s largest technical trade association focusing on surface mount and related technologies, announces that it will host a workshop titled Handling Moisture-Sensitive Components & PCBs Without Failure on Wednesday, January 25, 2012 at the Stoke Mandeville Stadium in Aylesbury, Buckinghamshire, UK.

The SMART Group

Plan your engineering process improvement with a monthly online webinar

Industry News | 2017-04-13 06:06:32.0

Solderability Benchmarking, Failures & Testing Methods 14th August All our webinars are based on 2.30pm UK time go to https://www.bobwillis.co.uk/events/ Benchmarking you PCB surface finish or the impact of baking boards or components can be simple in production and the laboratoy. Long term solderability of component terminations and printed circuit boards is fundamental in modern assembly processes. This is all practical experience not just theory for the presenters countless studies in industry

ASKbobwillis.com

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