Industry News | 2018-10-18 08:53:06.0
Mixed process of SMT reflow oven
Industry News | 2018-05-20 18:31:27.0
SHENMAO America today announced plans to exhibit at the eSMART Factory Conference, jointly organized by Global SMT & Packaging magazine and the SMTA, on Thursday, May 24, 2018 at the Plug ‘n Play Tech Center in Sunnyvale, CA. SHENMAO will highlight the new PF606-P245 Lead-free Zero Halogen Solder Paste. PF606-P245 paste improves ICT testability by completely removing flux to prevent contamination of test pins during test operation.
Industry News | 2020-12-01 02:52:15.0
SHENMAO America, Inc. is pleased to introduce its Joint-Enhanced Solder Paste (JEP) PF606-EP Series. JEP offers the advantages of both traditional solder paste and anisotropic conductive paste.
Industry News | 2018-07-02 21:54:56.0
SHENMAO America, Inc. is pleased to introduce the PF606-P245 New Generation Lead-free Zero Halogen Solder Paste. The paste provides continuous high-speed printability that produces superior solder paste print quality as well as a wide reflow process window for excellent solderability.
Industry News | 2021-03-04 08:51:46.0
SHENMAO America, Inc. has introduced its PF719-P250 thermal fatigue resistant solder alloy for automobile electronics. With a wide process window and a variety of unique features, this solder paste is ideal for even the most complicated printed circuit board (PCB) design.
Industry News | 2021-08-26 11:02:27.0
SHENMAO America, Inc.'s Joint Enhanced Solder Paste (JEP) PF606-EP305 offers the advantages of both conventional solder paste and anisotropic conductive paste, i.e., self-alignment and planar insulation, respectively. JEP enables soldering and joint encapsulation in one step reflow.
Industry News | 2023-10-23 09:22:43.0
ZESTRON is excited to announce an upcoming webinar titled "Cleaning Performance Evaluations and Best Practices for Novel Jettable Pastes for Advanced Packaging and SMT Assembly Process" on October 19th, 2023, at 2:00 PM EST.
Industry News | 2018-01-24 20:47:58.0
SHENMAO America today announced plans to exhibit in Booth #2344 at the 2018 IPC APEX EXPO, scheduled to take place Feb. 27 - March 1, 2018 at the San Diego Convention Center in Ca. The company’s new PF606-P140 / PF606-P245 Lead-free Zero Halogen Solder Pastes can eliminate Head-in-pillow (HiP) defects, voids, slumping, non-wetting opens and short stencil life.
Industry News | 2018-12-08 03:38:44.0
Lead-Free (Pb-Free) Solder and Composition
Industry News | 2005-12-15 11:50:05.0
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