Industry News | 2011-12-14 15:35:33.0
Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.
Industry News | 2011-10-03 15:19:17.0
IPC invites accredited U.S. and international colleges and universities with a strong focus on the electronics industry to submit paper abstracts for IPC’s International Academic Paper Competition.
Industry News | 2011-08-24 17:13:21.0
The IPC Conference on Reliability: Assembly Process for a Reliable Product will be held November 1-2, 2011, in Irvine, Calif. The conference will address reliability issues that arise at the assembly level, dedicating half-day programs on new developments in each of three key areas: materials, processes, and test and inspection.
Industry News | 2011-12-14 15:47:27.0
Featuring new research and innovations in printed board design and manufacturing, electronics assembly and test, the IPC APEX EXPO® technical conference will be held at the San Diego Convention Center, February 28-March 1, 2012.
Industry News | 2013-09-03 14:27:38.0
The ÉOLANE Group is the 4th largest European electronic subcontractor, currently employing 3,000 personnel across 20 European facilities, with 10 sites manufacturing in France.
Industry News | 2002-05-08 10:12:19.0
With 40 Nanosecond (ns) Core Access Time
Industry News | 2011-06-16 13:58:56.0
JEDEC Solid State Technology Association announced the publication of JESD84-B45: Embedded MultiMediaCard (e•MMC), Electrical Standard (Version 4.5 Device).
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