Industry News | 2003-06-04 09:19:23.0
With increasing demand for fine pitch placements and a growing amount of fast turnaround high-tech low-volume prototype work, Speedboard has invested in additional SMT/BGA placement/rework equipment.
Industry News | 2003-03-20 09:03:05.0
Organizing a Flip Chip and BGA Packaging Technologies Workshop as a part of the SMTA Boston 2003 Conference (June 9-11) at the Bayside Convention Center in Boston, Massachusetts.
Industry News | 2003-04-21 09:12:57.0
June 9-11 at the Bayside Convention Center
Industry News | 2016-01-17 19:26:58.0
In order to keep up with industry demand, IPC has released amendments for J-STD-001F, Requirements for Soldered Electrical and Electronic Assemblies, and IPC-A-610F, Acceptability of Electronic Assemblies. For each standard, IPC-A-610F Amendment 1 and IPC J-STD-001F Amendment 1 represents a critical shift to deliver necessary updates to these already robust standards.
Industry News | 2018-12-08 03:38:44.0
Lead-Free (Pb-Free) Solder and Composition
Industry News | 2019-03-05 17:28:22.0
The IPC Education Foundation was formally launched during IPC APEX EXPO 2019. As part of that launch, the Foundation committed to starting scholarship programs to raise awareness and reward educators and students that have interest in the electronics industry and the engineering disciplines. On March 4, 2019, the first two of these scholarship programs were opened to eligible participants.
Industry News | 2010-06-16 14:00:47.0
Minneapolis, MN - The SMTA is pleased to announce that the program for SMTA International is finalized and available on-line at www.smta.org/smtai and registration is open. The conference will be held at the Walt Disney World Swan and Dolphin Resort in Orlando, Florida on October 24-28, 2010. This year's program allows the attendee to choose from 20 courses, 130 technical papers, 4 focused symposia, and numerous free offerings throughout the conference.
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