Industry News | 2022-06-24 10:13:15.0
SHENMAO America, Inc. is pleased to offer its enhanced Solder Joint Encapsulation Material (SJEM) SMEF-Z52 Flux. The SJEM Flux combines the abilities of conventional flux and underfill. The epoxy cures after reflow and provides excellent bonding strength and joint protection. Joint reliability performance is elevated as well.
Industry News | 2004-11-10 18:04:10.0
Frenchtown, NJ, November 2004
Industry News | 2003-05-05 09:13:55.0
Reliable Wire Bonders for High Yield Production
Industry News | 2016-06-05 13:20:49.0
SHENMAO PF606-P116 Halogen Free Water Soluble LED Die Bonding Solder Pastes are made locally in the USA and with the same quality in 8 other worldwide locations.
Industry News | 2023-09-14 17:50:57.0
SHENMAO America, Inc. is proud to introduce its latest innovation in response to the growing demand for ultra-thin packages in the electronics industry. With the increase in package thinness, the challenge of package warpage and its impact on production yield has become more pronounced.
Industry News | 2018-12-08 03:33:27.0
How Electronic / Electrical Circuit Works
Industry News | 2018-12-08 03:38:44.0
Lead-Free (Pb-Free) Solder and Composition
Industry News | 2008-06-26 13:16:22.0
WILSONVILLE, Ore., June 26, 2008 � Mentor Graphics Corporation (Nasdaq: MENT) today announced the publication of a new book written by Charles Pfeil, engineering director of Mentor�s Systems Design Division, entitled BGA Breakouts and Routing, Effective Design Methods for Very Large BGA.
Industry News | 2010-03-04 11:30:26.0
POWAY, CA — March 2010 — EasySpheres recently finalized and opened an enhanced Web-based ordering portal for customers interested in purchasing solder balls and/or solder spheres for BGA rework applications and low-volume manufacturing.
Industry News | 2019-03-03 18:54:54.0
PDR today announced the release of Re-Ball Mode Software now available as part of its award-winning ThermoActive Suite Software Package. This latest feature allows the operator to select the software configuration, temperature management and profile management necessary for the successful completion of BGA re-balling operations when using PDR Systems.
