Industry News | 2021-09-07 11:14:42.0
Odyssey 1325 provides high reliability BGA alloy exchange and component re-finishing capabilities.
Industry News | 2021-10-18 12:49:19.0
Odyssey 1325 provides high reliability BGA alloy exchange and component re-finishing capabilities.
Industry News | 2022-03-07 16:53:18.0
Odyssey 1325 provides high reliability BGA alloy exchange and component re-finishing capabilities.
Industry News | 2024-03-26 13:10:05.0
PDR Rework proudly announces the appointment of Leo Gibbs as the Commercial Director. In his new role, Gibbs will play a pivotal part in steering the company's commercial strategies, further solidifying PDR Rework's position as an industry leader in advanced rework solutions.
Industry News | 2010-08-27 07:25:03.0
Package on Package (PoP) applications are growing in popularity for mobile and handheld professional electronics applications and with it placing further demands on assembly engineers.
Industry News | 2024-08-07 09:15:59.0
PEMTRON today announced plans to exhibit at the upcoming KPCA Show, taking place Sept. 4-6, 2024 in Korea. Attendees will find PEMTRON at Booth J401, where the company will demonstrate its state-of-the-art POSEIDON and 8800AI inspection systems.
Industry News | 2018-03-25 13:21:16.0
The widest selection of online webinars in the industry has added more titles
Industry News | 2021-05-18 14:19:48.0
Photon steam aging system provides accelerated life testing simulating elongated storage conditions for high reliability applications.
Industry News | 2023-11-13 12:31:47.0
Circuit Technology Center announces it has added the capability to trim and form electronic component packages to customers' exact pre-assembly specifications. They can also propose a trim and lead-form drawing if needed. Dedicated, custom tooling can be fabricated to meet custom package requirements.
Industry News | 2016-07-08 19:09:41.0
Carlsbad, CA – July 8: Machine Vision Products (MVP) today announced it would be demonstrating their diverse inspection toolbox on the MVP 850 Platform for Microelectronics and Packaging at the Semicon West 2016 exhibition. Applications will include Lead Frame inspection for die placement, epoxy and wire bond as well as demonstrating new surface inspection capabilities. The exhibition is at the Moscone Center in San Francisco from July 12-14 2016. Machine Vision Products are exhibiting at booth #6471 in the North Hall.
