Industry News: bga corner bonding (Page 14 of 14)

Viscom Technology Forum Looks to the Future

Industry News | 2019-07-17 19:57:39.0

At Viscom's Technology Forum this year on June 5-6 in Hanover, Germany, board member Carsten Salewski welcomed all present participants, who then debated "The Future of Electronics Manufacturing" together with outstanding speakers. Viscom sales engineer Michael Mügge moderated the forum.

Viscom AG

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