Industry News: bga corner bonding (Page 7 of 14)

SHENMAO Introduces New Joint-Enhanced Solder Paste Series

Industry News | 2020-12-01 02:52:15.0

SHENMAO America, Inc. is pleased to introduce its Joint-Enhanced Solder Paste (JEP) PF606-EP Series. JEP offers the advantages of both traditional solder paste and anisotropic conductive paste.

Shenmao Technology Inc.

New Joint Enhanced Solder Paste and Solder Joint Encapsulation Material Flux from SHENMAO

Industry News | 2021-03-02 14:45:26.0

SHENMAO America, Inc. is pleased to introduce its newJoint Enhanced Solder Paste (JEP) PF606-EP305 and Solder Joint Encapsulation Material (SJEM) Flux SMEF-Z52. The new epoxy-based solder materials for very fine pad size (70 μm) soldering, especially for advanced display packaging and assembly.

Shenmao Technology Inc.

SHENMAO Offers Industry-Leading UV Visible Lead-Free No-Clean Solder Paste PF629-P214UV

Industry News | 2023-04-24 19:16:05.0

SHENMAO America, Inc. is proud to announce the release of its new product, the UV Visible Lead-Free No-Clean Solder Paste PF629-P214UV. This innovative new solder paste is designed to meet the demands of modern electronics manufacturing, offering excellent performance and reliability.

Shenmao Technology Inc.

PEMTRON to Spotlight World-Class Semiconductor Inspection Solutions at SEMICON West 2024

Industry News | 2024-06-17 12:20:15.0

PEMTRON is excited to announce its participation in SEMICON West, the premier event for the semiconductor manufacturing industry. Taking place from July 9-11, 2024 at the Moscone Center in San Francisco, California, PEMTRON will discuss its innovative inspection systems at #booth 865.

Pemtron

MARTIN to Demonstrate Standalone QFN Solder Bumping and BGA Reball Unit at SMTA Capital Expo

Industry News | 2010-09-15 21:55:19.0

MARTIN will demonstrate the Prebump/Reball 03.1 unit at the upcoming SMTA Capital Expo and Tech Forum, scheduled to take place Tuesday, September 21, 2010 at the Johns Hopkins University/Applied Physics Lab in Laurel, MD.

Finetech

MARTIN to Demonstrate Stand Alone QFN Solder Bumping and BGA Reball Unit at the CTEA Austin Expo & Tech Forum

Industry News | 2010-10-04 15:37:18.0

MARTIN will demonstrate the Prebump/Reball 03.1 unit at the upcoming Central Texas Electronics Association (SMTA/IMAPS) Expo & Tech Forum, scheduled to take place, October 7, 2010 at the Norris Conference Centers in Austin, TX.

Finetech

MARTIN to Demonstrate Stand Alone QFN Solder Bumping and BGA Reball Unit at the SMTA Arizona-Sonora Expo & Tech Forum

Industry News | 2010-11-18 11:04:08.0

MARTIN will demonstrate the Prebump/Reball 03.1 unit at the upcoming SMTA Arizona-Sonora Expo & Tech Forum, scheduled to take place Wednesday, December 1, 2010 at the Fiesta Inn Resort & Conference Center in Tempe, AZ.

Finetech

X-Ray Inspection System features 5 micron resolution

Industry News | 2004-10-01 12:15:58.0

Verifer HR High-Resolution X-Ray Inspection Solution Under $60K

MatriX Technologies GmbH

Focused IR Rework Technology from PDR to be Displayed in the Tecnolab Booth at productronica – Hall A2, Booth 459

Industry News | 2017-10-17 20:12:01.0

PDR today announced plans to exhibit with its Italian distributor Tecnolab in Hall A2, Booth 459 at productronica 2017, scheduled to take place Nov. 14 – 17, 2017 at the Messe München in Germany. Technolab will display PDR’s IR-E3G Gold SMD/BGA Rework Station and IR-TS One Benchtop Thermal Testing System. PDR’s advanced focused IR rework technology is ideal when reworking multiple components on the same PCB. The company’s nozzle-free design offers the immediate configuration of your system for same size and varying size components without having to stop and change air nozzles.

PDR-America


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