Industry News: bga corner bonding (Page 9 of 14)

PEMTRON to Exhibit a Benchmark in AOI & SPI Technology at SMTA Chihuahua Expo

Industry News | 2024-07-01 11:29:20.0

PEMTRON is excited to announce its participation in the SMTA Chihuahua Expo & Tech Forum. The event is scheduled to take place Thursday, Aug. 15, 2024 at the Hotel Sheraton Soberano Barranca Del Cobre in Chihuahua, Mexico. PEMTRON will be focusing on its revolutionary D2 (Dual Lane & Dual Head) Series.

Pemtron

Discover PEMTRON's Dual Lane Dual Head AOI/SPI Technology at NEPCON Vietnam 2024

Industry News | 2024-08-12 15:00:28.0

PEMTRON, an inspection equipment developer and supplier, today announced plans to exhibit at NEPCON Vietnam Hanoi 2024. The event is set to take place Sept. 11-13, 2024 at the I.C.E Hanoi (Cung Van Hoa), Vietnam. Be sure to visit PEMTRON at Booth G17, where their team will highlight the D2 (Dual Lane & Dual Head) Series, showcasing the latest advancements in Automated Optical Inspection (AOI) and Solder Paste Inspection (SPI) technology.

Pemtron

PEMTRON Presents Its Latest Advancement in AOI & SPI at SMTA Guadalajara

Industry News | 2024-08-19 16:24:23.0

PEMTRON is pleased to announce plans to exhibit at SMTA Guadalajara, scheduled to take place Sept. 11-12, 2024 at the Expo Guadalajara, Salón Jalisco Hall D & E. PEMTRON will exhibit in Booth 322, focusing on its groundbreaking D2 (Dual Lane & Dual Head) Series AOI and SPI system.

Pemtron

Dr. Evstatin Krastev from Nordson DAGE to Present Two Ground-breaking X-ray Inspection Studies during the Technical Sessions at SMTAI 2014

Industry News | 2014-08-28 15:48:58.0

Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), announces that Dr. Evstatin Krastev, Director of Applications, will present two papers at the upcoming SMTA International exhibition.

Nordson DAGE

Cobar Europe Introduces New Products from Yincae Advanced Materials

Industry News | 2010-09-16 21:44:04.0

The Balver Zinn Group announces that Cobar Europe BV now distributes Yincae Advanced Materials’ SMT 158 Capillary Underfill and SMT 256 Individual Solder Joint Encapsulations throughout Europe.

Cobar Solder Products Inc.

MARTIN to Demonstrate BGA Reball/Pre-Bump Unit at the SMTA Dallas and Houston Expo & Tech Forums

Industry News | 2011-02-17 14:59:07.0

MARTIN will showcase its Mini-Oven 04 Reball/Prebump unit at the upcoming SMTA Dallas and Houston Expo & Tech Forums. The SMTA Dallas Expo & Tech Forum is scheduled to take place Tuesday, March 1, 2011 at the Richardson Civic Center in Richardson, TX and the SMTA Houston Expo & Tech Forum is scheduled to take place Thursday, March 3, 2011 at the Stafford Centre in Stafford, TX.

Finetech

MARTIN to Participate in Package on Package (PoP) Design and Assembly Center SMTA International 2012

Industry News | 2012-09-10 09:15:27.0

MARTIN will be one of nine companies participating in the Package on Package Design and Assembly Center (PoP Center) at SMTA International this year.

Finetech

Al Cabral Joins Finetech as Regional Sales Manager

Industry News | 2013-05-28 14:45:16.0

Finetech & Martin announce the appointment of Al Cabral as Regional Sales Manager.

Finetech

Solder Joint Encapsulant for Ball Bumping Applications: BP 256

Industry News | 2014-09-22 10:40:15.0

YINCAE Advanced Materials, LLC is pleased to announce the release and availability of BP 256. It is a part of the innovative SMT 256/266 series, solder joint encapsulant.

YINCAE Advanced Materials, LLC.

Metcal Develops New Hand-Piece to Meet Higher Thermal Demands

Industry News | 2015-01-05 19:59:08.0

Metcal is pleased to introduce the new MX-HPDC dual cartridge hand-piece and MX-WHPDC work-stand. Designed to meet higher thermal demands, five new SMTC dual-shaft cartridge geometries also are available in two temperature series.

Metcal


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