Industry News: bga reliability (Page 12 of 40)

Micross Components, Inc. Purchases Hentec/RPS Photon Steam Aging System

Industry News | 2021-11-09 10:43:21.0

Photon steam aging system provides accelerated life testing simulating elongated storage conditions for high reliability applications.

Hentec Industries, Inc. (RPS Automation)

ePAK International Purchases Hentec/RPS Photon Steam Aging System

Industry News | 2021-12-06 15:28:38.0

Photon steam aging system provides accelerated life testing simulating elongated storage conditions for high reliability applications.

Hentec Industries, Inc. (RPS Automation)

Hentec/RPS Receives Order from Spirit Electronics for Photon Steam Aging System

Industry News | 2022-02-14 16:16:50.0

Photon steam aging system provides accelerated life testing simulating elongated storage conditions for high reliability applications.

Hentec Industries, Inc. (RPS Automation)

PACE & Cumberland Electronics to Present BGA/Area Array Component Rework Workshops in Philadelphia & Baltimore in September

Industry News | 2019-08-29 21:58:20.0

PACE Worldwide and Cumberland Electronics have teamed up to host two separate Technical Workshops on "Non-Destructive BGA/Area Array Component Rework" on September 10th at ACI Technologies in Philadelphia PA, and on September 12th at the PACENTER Training Center in Elkridge MD.

PACE Worldwide

Aqueous Technologies Receives Best Paper Recognition at SMART Group BGA and Cleaning Reliability Conference

Industry News | 2011-10-25 00:31:18.0

Aqueous Technologies announces that CEO Michael Konrad was voted Best Paper by delegates at the recent SMART Group Conference at the Oxfordshire Golf Club in Thame, UK.

Aqueous Technologies Corporation

APS Novastar Introduces Automated Vision Control for L-Series Pick and Place Systems

Industry News | 2008-10-07 12:56:56.0

APS Novastar introduces automatic Vision Control for its L-Series pick and place systems. Vision Control advances the already precise, fast and reliable placement of 0201's with 100% accurate on-the-fly, bottom-up vision placement of micro BGA's and ultra fine pitch QFP's.

DDM Novastar Inc

STI Electronics Introduces Alternative to Standard Rigid Arrays

Industry News | 2011-09-19 13:31:20.0

STI Electronics introduces its new Micro-Coil Spring Array as an improved alternative to standard rigid arrays.

STI Electronics

SHENMAO Exhibits at ECTC in Las Vegas June 1-2, 2016 Booth # 505 Introduces BGA and Micro BGA Solder Spheres

Industry News | 2016-05-16 16:16:21.0

SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high quality sphericity.

Shenmao Technology Inc.

Hentec/RPS to Participate in IPC APEX EXPO 2021 Virtual Event

Industry News | 2021-02-17 11:49:45.0

A full range of automated selective soldering machines, component lead tinning machines and solderability test equipment will be on exhibit.

Hentec Industries, Inc. (RPS Automation)

Hentec/RPS to Exhibit Complete Product Lineup at IPC APEX EXPO

Industry News | 2021-11-29 14:55:05.0

A full range of automated selective soldering machines, component lead tinning systems and solderability test equipment will be on exhibit.

Hentec Industries, Inc. (RPS Automation)


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