Industry News: bga solder (Page 12 of 71)

IPC Extends Deadline on Call for Participation for IPC APEX EXPO 2017 Deadline for technical conference paper abstracts extended to: July 8, 2016

Industry News | 2016-07-02 06:45:13.0

IPC — Association Connecting Electronics Industries® has extended the deadline of their invitation for engineers, researchers, academics, technical experts and industry leaders to submit abstracts for IPC APEX EXPO 2017 to be held at the San Diego Convention Center. Professional development courses will take place February 12, 13 and 16, 2017 and the technical conference will take place February 14–16, 2017. The extended deadline is July 8, 2016.

Association Connecting Electronics Industries (IPC)

IPC Invites Industry Leaders to Submit Poster Abstracts for IPC APEX EXPO 2020 in San Diego

Industry News | 2019-09-10 13:25:11.0

IPC — Association Connecting Electronics Industries® invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO®, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test. Poster presentations are scheduled for Wednesday, February 5, 2020, and will be displayed throughout the event, offering additional visibility.

Association Connecting Electronics Industries (IPC)

IPC Extends Deadline on Call for Participation for IPC APEX EXPO 2018 Deadline for technical conference paper abstracts extended to: July 21, 2017

Industry News | 2017-07-17 18:33:56.0

IPC — Association Connecting Electronics Industries® has extended the deadline of their invitation for engineers, researchers, academics, technical experts and industry leaders to submit abstracts for IPC APEX EXPO 2018 to be held at the San Diego Convention Center. Professional development courses will take place February 25, 26 and March 1, 2018 and the technical conference will take place February 27–March 1, 2018. The extended deadline for technical conference abstracts is July 21, 2017.

Association Connecting Electronics Industries (IPC)

IPC Issues Call for Participation for IPC APEX EXPO 2018

Industry News | 2017-03-06 13:35:05.0

IPC — Association Connecting Electronics Industries® invites engineers, researchers, academics, technical experts and industry leaders to submit abstracts for IPC APEX EXPO® 2018 to be held at the San Diego Convention Center. Professional development courses will take place February 25, 26 and March 1, 2018 and the technical conference will take place February 27–March 1, 2018.

Association Connecting Electronics Industries (IPC)

A Look to the Future in the Electronics Industry at IPC APEX EXPO® 2013

Industry News | 2013-01-19 07:46:16.0

Information that inspires innovation is center-stage for design, printed boards, electronics assembly, test and printed electronics

Association Connecting Electronics Industries (IPC)

BEST Inc. Puts Semi-Automated Mass PCB Rework Process Online

Industry News | 2017-03-31 12:29:11.0

BEST installs and brings Up mass rework machine capability to reduce costs and increase the turnover of boards requiring lots of parts change outs.

BEST Inc.

Reballing Preforms Now in 3 Days

Industry News | 2013-09-03 11:52:21.0

BEST's EZReball(TM) reballing preforms now are available as standard in 3 business days. Expedited packs are in available in 24 hours to help you with your reballing projects

BEST Inc.

Custom SRT and Hot Air Nozzles

Industry News | 2019-05-12 15:58:00.0

Fast Shipment of Custom SRT Nozzles

BEST Inc.

BEST Releases 2nd Half Training Schedule for 2016

Industry News | 2016-05-25 18:26:38.0

BEST's 2nd half of 2016 schedule including more dates and classes in Detroit.

BEST Inc.

Seika Machinery Introduces PR1 Pocket Handy BGA Solder Ball Checker

Industry News | 2010-05-29 18:01:49.0

TORRANCE, CA — Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, introduces M.S. Engineering Co. Ltd.’s PR1 BGA Solder Ball Checker for fast and accurate inspection of BGA soldering and QFP lead sections.

Seika Machinery, Inc.


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