Industry News | 2019-03-05 17:59:34.0
SHENMAO America, Inc. is pleased to announce that it will exhibit at electronica China, scheduled to take place March 20-22, 2019 at the Shanghai New International Expo Centre. The company will showcase its PQ10 series low temperature solder paste, new P250 series solder paste for automobile electronics, PW215 water soluble solder paste, SMF-WC53 water soluble ball-attach flux and solder sphere, and water-based wave soldering flux & water-based cleaner.
Industry News | 2021-03-30 16:42:31.0
Odyssey component lead tinning machines provide high reliability BGA alloy exchange and component re-finishing capabilities.
Industry News | 2024-07-15 11:37:32.0
SHENMAO America, Inc. is pleased to announce that its various solder materials have received UL ECVP 2809 (UL Environmental Claim Validation Procedure, UL ECVP) certification for Recycled Content Standard, which now includes auditing of social responsibility procedures.
Industry News | 2003-04-07 11:00:15.0
The innovative VPI-1000 optical inspection system is the only benchtop SMT inspection system capable of inspecting BGA devices as standard, without necessitating a lengthy lens reconfiguration.
Industry News | 2011-01-14 13:06:07.0
Nihon Superior Co. Ltd. will exhibit in Booth # East 30-14 at the upcoming INTERNEPCON JAPAN, scheduled to take place January 19-21, 2011 at the Tokyo Big Sight in Tokyo, Japan.
Industry News | 2011-03-14 17:59:18.0
Nihon Superior Co. Ltd. will exhibit in Booth #259 at the upcoming IPC APEX EXPO, scheduled to take place April 12-14, 2011 at the Mandalay Bay Resort & Convention Center in Las Vegas.
Industry News | 2016-04-26 10:26:58.0
SHENMAO Technology, Inc. will present the technical paper “A New Dispensing Solder Paste for Laser Soldering Technology” at the 10 th. Anniversary of the SMTA International Conference of Soldering and Reliability 2016 in Toronto, Canada, featuring advancements in newly developed composition of Powder, Fluxes and produces best dispensability, minimal flux residue, no-splash or solder balling issues and minimal and smaller voids.
Industry News | 2018-10-18 10:23:07.0
Typical RoHS Issues in PCB Assembly
Industry News | 2017-01-29 09:37:08.0
TopLine will exhibit its MSC Series of Micro-coil springs, a novel interconnect for CCGA (Ceramic Column Grid Array) IC packages for harsh environments. In tests using daisy chain test vehicles, Micro-coil springs absorbed extreme shock of up to 50,000g before failing. Commercial applications include aerospace, avionics, military, down-hole oilfield drilling and automotive electronics. Test results were initially presented at IEEE CPMT 2012.
Industry News | 2020-06-11 05:50:07.0
Seika Machinery, Inc. announces a special summer sale on select products. Significant savings are available for McDry cabinets, Sawa stencil cleaners, Sayaka PCB routers, Malcom viscometers, paste mixers and profiler systems while stock lasts.
