Industry News: bga void specification ipc (Page 3 of 16)

Seven IPC APEX EXPO™ Technical Conference Sessions Go Global - Live From Las Vegas

Industry News | 2011-01-20 13:45:14.0

IPC will introduce a cyber conference at IPC APEX EXPO in Las Vegas in 2011. The IPC APEX EXPO Cyber Conference will feature live broadcasts and post-show archives of seven of the show's thirty-five technical conference sessions on April 12–14, 2011.

Association Connecting Electronics Industries (IPC)

Count On Tools, Inc. to Launch the QWIKTRAY Program for the U.S. Market at APEX

Industry News | 2016-02-16 11:59:42.0

Count On Tools will exhibit in Booth #2801 at the 2016 IPC APEX EXPO, scheduled to take place March 15-17, 2016 at the Las Vegas Convention Center. Company representatives will celebrate COT’s 25-year anniversary with several promotions and giveaways. Additionally, the IPC APEX EXPO will mark the official launch of the QWIKTRAY program for the U.S. market.

Count On Tools, Inc.

A Look to the Future in the Electronics Industry at IPC APEX EXPO® 2013

Industry News | 2013-01-19 07:46:16.0

Information that inspires innovation is center-stage for design, printed boards, electronics assembly, test and printed electronics

Association Connecting Electronics Industries (IPC)

SMTA International Conference Program Finalized and Registration Now Open

Industry News | 2013-06-11 19:23:26.0

The SMTA is pleased to announce that the program for SMTA International is finalized and available on-line at www.smta.org/smtai and registration is open.

Surface Mount Technology Association (SMTA)

BEST Releases 2nd Half Training Schedule for 2016

Industry News | 2016-05-25 18:26:38.0

BEST's 2nd half of 2016 schedule including more dates and classes in Detroit.

BEST Inc.

Nordson DAGE and Rockwell Collins Co-author Technical Paper on Voiding in Ball Grid Arrays

Industry News | 2011-09-23 22:09:26.0

Nordson DAGE announces that a Technical Paper entitled "The Last Will and Testament of the BGA Void" will be presented at the SMTA International Conference & Exhibition.

Nordson DAGE

PNC Inc.’s BGA Assembly

Industry News | 2017-03-23 11:33:40.0

Outline of PNC Inc's BGA assembly capabilities.

PNC Inc.

AMTECH Introduces a New Solder Paste, VS-213, Also Known as the Voidstopper

Industry News | 2014-06-17 21:50:29.0

SMT International has just introduced AMTECH VS-213 (a.k.a. the VOIDSTOPPER), a no-clean, lead-free solder paste formula that is 100% halogen-free based on all testing methods, including Oxygen Bomb Combustion and Ion Chromatography.

AMTECH

Indium Corporation’s Low-Voiding Solder Pastes Featured at IPC APEX 2016

Industry News | 2016-03-17 14:15:35.0

Manufacturers no longer have to settle for unacceptable levels of voiding when soldering QFNs, CSPs, or BGAs. Indium Corporation will help customers Avoid the Void™ with its void-reducing no-clean solder pastes at IPC APEX Expo.

Indium Corporation

Indium Corporation to Feature Low-Voiding Solder Paste at IPC APEX 2016

Industry News | 2016-02-06 01:03:23.0

Indium Corporation will feature its void-reducing no-clean solder pastes to help customers Avoid the Void™ at IPC APEX Expo.

Indium Corporation


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Association Connecting Electronics Industries (IPC)
Association Connecting Electronics Industries (IPC)

IPC is the trade association for the printed wiring board and electronics assembly industries.

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Phone: 847-615-7100

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