Industry News: bga warp (Page 1 of 1)

PRINCIPLE OF SURFACE MOUNT PROCESS(SMT PROCESS)

Industry News | 2018-10-18 08:59:34.0

PRINCIPLE OF SURFACE MOUNT PROCESS(SMT PROCESS)

Flason Electronic Co.,limited

Flextac Self-Adhesive Stencils Simplify BGA Rework

Industry News | 2001-02-26 11:18:45.0

Innovative Flextac Stencils simplify BGA rework. These self-sticking laser cut, polymer solder paste stencils use a residue-free adhesive similar to Post-it Notes to seal around BGA pads to ensure that solder paste will not bleed under the stencil when the paste is applied. Disposable Flextac Stencils are easy to use and will not leave any residue on the board surface.

Circuit Technology Center, Inc.

PACE Offers 10 Free Nozzles with the Purchase of New TF 1800 BGA Rework System

Industry News | 2016-10-26 14:55:50.0

Vass, NC – Sept 20, 2016 – PACE Worldwide announces an introductory promotion in conjunction with the launch of their new TF 1800 BGA/SMD Rework System, which began shipping in October. For a limited time, PACE will provide 10 Heat Focusing Nozzles free of charge with the purchase of each TF 1800 System, a value of over $3,400 (£2,700/€3,340).

PACE Worldwide

Indium Corporation to Host PCB and Component Defects Webinar

Industry News | 2020-08-22 04:07:55.0

Indium Corporation will host an InSIDER Series webinar on causes and solutions of PCB and component warpage defects, presented by industry consultant Bob Willis. There will be two sessions on Wednesday, Sept. 9--5:30 a.m. Eastern Time (10:30 a.m. London Time, 5:30 p.m. Malaysia Time) and Noon Eastern Time (5 p.m. London Time, Midnight Malaysia Time).

Indium Corporation

VJ Technologies to Showcase Leading Processes at APEX 2010

Industry News | 2010-03-27 18:27:23.0

VJ Technologies, Inc., the leader in Rework technologies and global provider of advanced X-ray inspection systems, announces that it will exhibit and demonstrate X-ray and Rework solutions in booth 2059 at the upcoming IPC/APEX conference and exhibition.

VJ Electronix

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