Industry News: blue residue in solder joints (Page 1 of 3)

Electronics in Harsh Environments Conference Announced

Industry News | 2017-08-26 20:18:39.0

SMTA and SMART Group are excited to announce plans to co-organize the Electronics in Harsh Environments Conference. The event will be held April 24-26, 2018 in Amsterdam, Netherlands. The conference will focus on building reliable electronics used in power electronics and harsh environments.

Surface Mount Technology Association (SMTA)

Electronics in Harsh Environments Conference Program Announced

Industry News | 2023-03-27 13:03:23.0

SMTA Europe is proud to announce the 2023 Electronics in Harsh Environments Conference, taking place May 23-25 in Amsterdam, Netherlands. This global conference is a three-day technical event focused on building reliable electronics used in power electronics and harsh environments.

Surface Mount Technology Association (SMTA)

IPC International Conference in Budapest Highlights Process Steps for Manufacturing Quality Electronic Products

Industry News | 2011-01-22 00:27:29.0

Design, assembly, soldering, repair, rework, inspection, and materials choice are all variables to be juggled as electronics manufacturers worldwide work with new component types, high speed signals and lead-free technology. To assist them in making the best choices for producing reliable electronics, IPC — Association Connecting Electronics Industries® is holding the IPC Conference on Quality, Reliability and Acceptability for Electronics Manufacturing in Budapest, Hungary, on 22–24 February 2011.

Association Connecting Electronics Industries (IPC)

A Look to the Future in the Electronics Industry at IPC APEX EXPO® 2013

Industry News | 2013-01-19 07:46:16.0

Information that inspires innovation is center-stage for design, printed boards, electronics assembly, test and printed electronics

Association Connecting Electronics Industries (IPC)

Viscom picks up two awards in Asia for its economical 3D AOI

Industry News | 2017-05-09 15:32:04.0

Viscom is pleased to announce that it has been awarded a 2017 EM Asia Innovation Award in the category of Test Measurement / Inspection System: AOI for the S3088 ultra blue. The award was presented to the company during an April 26, 2017 ceremony at the Shanghai World Expo Exhibition & Convention Center during NEPCON China. This marks the company’s second award in Asia for the system, following the SMT China Vision Award ceremony the day before.

Viscom AG

SHENMAO America to Participate in the eSMART Factory Conference

Industry News | 2018-05-20 18:31:27.0

SHENMAO America today announced plans to exhibit at the eSMART Factory Conference, jointly organized by Global SMT & Packaging magazine and the SMTA, on Thursday, May 24, 2018 at the Plug ‘n Play Tech Center in Sunnyvale, CA. SHENMAO will highlight the new PF606-P245 Lead-free Zero Halogen Solder Paste. PF606-P245 paste improves ICT testability by completely removing flux to prevent contamination of test pins during test operation.

Shenmao Technology Inc.

SEHO and STANNOL Start Strategic Cooperation in the American Market

Industry News | 2014-11-04 17:34:02.0

SEHO Systems GmbH announces that it will cooperate with STANNOL GmbH in the American market. For more than 130 years, STANNOL has been a reliable partner to the electronics industry when it comes to innovative soldering materials such as solder and flux.

SEHO Systems GmbH

Cobar’s Advanced Technologies Featured in the APEX Hand Solder Competition

Industry News | 2012-04-10 14:47:49.0

The Balver Zinn/Cobar Group announces that its SN100C Wire Solder and Cobrush flux applicator were demonstrated at the first Hand Solder Competition at the recently held IPC APEX EXPO in San Diego.

Cobar Solder Products Inc.

SHENMAO Exhibits at ECTC in Las Vegas June 1-2, 2016 Booth # 505 Introduces Laser Soldering Paste

Industry News | 2016-05-31 20:58:06.0

SHENMAO Features a new Sn-3.0Ag-0.5Cu Lead-Free Solder Paste PF606-P133H for laser soldering applications. Dispensed from syringes, it is developed for automatic laser soldering processes in the packaging and assembly of surface mount devices and microelectronics. Laser energy is applied at the precise location in a non-contact procedure to create high shear strength well-formed solder joints during the lower thermal stress process while reducing intermetallic formation. PF606-P133H solder paste produces minimal flux residue and no-splash or solder balling issues. It is well suited for high yield soldering of sensitive electronic components in manufacturing or repair of electronic devices that can-not tolerate conventional reflow-oven temperature.

Shenmao Technology Inc.

SHENMAO Exhibits at IMAPS System in Package June 27-28, 2017 Introducing 3 New Semiconductor Packaging Fluxes

Industry News | 2017-06-25 20:33:39.0

SHENMAO Technology, Inc. introduces New Generation Ultra Tacky Flux SMF-WC52 applied in the Flip Chip dipping process. Its high tacky property keeps Chip in place during reflow for excellent soldering performance, while creating outstanding solder joint strength.

Shenmao Technology Inc.

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