Industry News: bridges (Page 36 of 52)

New webinar from Nano Dimension discusses 3D printed 5G antennas and advanced microwave devices with AME Technology

Industry News | 2020-11-10 15:22:51.0

Nano Dimension Ltd. (Nasdaq: NNDM) announced today that it will hold a new webinar on Friday, Nov. 20, 2020 at 10 a.m. ET / 4 pm. CET.

Nano Dimension

Ersa to Offer Demos in Interactive Virtual Showrooms during APEX Virtual EXPO

Industry News | 2021-02-12 16:18:20.0

Kurtz Ersa Inc. today announced plans to participate in the 2021 IPC APEX Virtual EXPO, scheduled to take place March 9-11, 2021 online at www.ipcapexexpo.org. Ersa has upgraded its demo/application centers to interactive virtual showrooms where the team will give customers in depth and personalized equipment demonstrations for wave soldering, reflow soldering, selective soldering, rework equipment, I4.0 connectivity and more. The company will highlight the EXOS 10/26, Ersa VERSAEYE and and HR 600 XL during the virtual event.

kurtz ersa Corporation

EVK9351AUT Accelerates Project Launch for Optical Gigabit Connectivity

Industry News | 2021-05-11 07:41:53.0

KDPOF Integrates KD9351 and KD1053 in Extensive Evaluation Kit to Facilitate Project Entry for Safe Backbone and ADAS Sensor Links in Vehicles

KDPOF

Nano Dimension Presents:"What Is AME and Its Impact on the Industry Roadmap?"

Industry News | 2021-07-15 04:01:58.0

Nano Dimension Ltd. (Nasdaq: NNDM) today announced a new webinar based on the successful AME Academy presentation. The webinar, entitled "What Is AME and Its Impact on the Industry Roadmap?" is scheduled to take place Thursday, July 29, 2021 at 10 a.m. EST.

Nano Dimension

Europlacer Announces Intelligent Freeform Feeder for Loose Pick & Place Parts.

Industry News | 2021-12-03 06:33:06.0

With component shortages plaguing the electronics industry and putting additional pressures on SMT assembly operations, the introduction of a new freeform feeder compatible with all Europlacer pick & place platforms is timely.

EUROPLACER

ARIES Embedded Presents New MCXL Reference IP Design

Industry News | 2022-03-30 12:41:51.0

MCXL Embedded Module Relies on Intel Cyclone 10 LP FPGAs and HyperBus Technology for Industrial Control and Communications

ARIES Embedded GmbH

StenTech to Introduce Advanced Nano Durable Stencil Coating at APEX 2023

Industry News | 2022-12-14 12:10:28.0

StenTech Inc. will introduce its new Advanced Nano Coating at the 2023 IPC APEX EXPO, scheduled to take place Jan. 24-26, 2023 at the San Diego Convention Center in California. Additionally, the company will have its complete product line of various stencils and tooling on display – Meet with the StenTech team in Booth #2150!

Stentech

Saelig Unveils Patented Pulsiv OSMIUM Power Electronics Technology to Minimize Energy Waste

Industry News | 2023-04-06 16:07:01.0

Novel Pulsiv OSMIUM technology delivers high power factor, consistently high efficiency up to 99.5%, in an ultra-compact system design. Pulsiv OSMIUM power electronics technology can be used to improve overall system efficiency, and optimize BOM cost.

Saelig Co. Inc.

TRI wins two 2023 EM Asia Innovation Awards

Industry News | 2023-04-24 19:24:20.0

Test Research, Inc. (TRI) has received two prestigious EM Asia Innovation awards at Productronica China for its new products, 3D SPI TR7007 SII Ultra and 3D AOI TR7500QE Plus. The TR7007 SII Ultra won the SPI – SMT Inspection award, while the TR7500QE Plus won the Outstanding Product of the Year award.

TRI - Test Research, Inc. USA

Heraeus Electronics and Bosch Sign Patent and Know-How License Agreement for Inorganic Potting Technology at PCIM Europe Exhibition

Industry News | 2023-05-30 06:38:19.0

Heraeus Electronics and Robert Bosch GmbH have signed a patent and know-how license agreement at the PCIM Europe exhibition in Nuremberg, Germany. The agreement allows Heraeus Electronics to access a valuable patent portfolio from Bosch to accelerate the development of their inorganic potting compound, CemPack®, for encapsulation of power modules.

Heraeus


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