Industry News | 2018-10-18 10:54:51.0
Circuit Board Repair and Rework
Industry News | 2013-01-30 17:54:43.0
Design, assembly, inspection and repair personnel have a new tool to help improve reliability of ball grid arrays (BGAs) and fine-pitch ball grid arrays (FBGAs) in high density applications, thanks to the newly released C revision of IPC-7095, Design and Assembly Process Implementation for BGAs.
Industry News | 2010-04-10 02:05:54.0
IPC released today the A revision of IPC J-STD-609, Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-Free) and Other Attributes. This standard presents a marking and labeling system that aids in electronics assembly, rework, repair and recycling, and now provides additional codes for the more precise specification of certain lead-free solders.
Industry News | 2012-08-09 18:42:34.0
IPC has released IPC-HDBK-850, Guidelines for Design, Selection and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assembly.
Industry News | 2011-05-03 22:50:52.0
Assemblers who have tried to resolve problems that stem from the rapidly growing array of advanced packages are getting some help from IPC with the newly released IPC-7093, Design and Assembly Process Implementation for Bottom Termination Components. This standard describes the critical design, assembly, inspection, repair, and reliability issues associated with bottom termination components (BTCs) whose external connections consist of metallized terminals that are an integral part of the component body.
Industry News | 2012-12-14 06:50:53.0
e IPC APEX EXPO® Technical Conference will cover two dozen technical topics in the areas of board fabrication, design and electronics assembly.
Industry News | 2019-10-24 10:36:03.0
The third annual M-EXPO Wire Processing Technology event held in Ciudad Juárez, México at the Cuatro Siglos Convention Center on October 9-11, 2019, exceeded expectations. This event was co-located with the ninth annual EXPO-MRO. These two events hosted more than 6,500 attendees.
Industry News | 2012-10-16 18:56:39.0
IPC — Association Connecting Electronics Industries® will hold “IPC Conference on Solderability and Reliability for Electronics Assemblies” on 6-7 February 2013, in Budapest, Hungary.
Industry News | 2010-12-03 21:35:04.0
Eastern Europe's growing electronics assembly industry faces new challenges, especially with the adoption of lead-free technology. To connect manufacturers with solutions to these challenges, IPC — Association Connecting Electronics Industries® is holding the IPC Conference on Quality, Reliability and Acceptability for Electronics Manufacturing in Budapest, Hungary, on 22–24 February 2011.
Industry News | 2011-05-03 22:58:11.0
IPC invites researchers, academics, technical experts and industry leaders to submit abstracts for the 2012 IPC APEX EXPO™ at the San Diego Convention Center in San Diego, Calif. The technical conference will be held February 28–March 1, 2012, and the professional development courses will be February 26–27 and March 1, 2012.
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