Industry News | 2003-05-05 09:21:23.0
Features a 50% Reduction in Length
Industry News | 2022-10-24 08:01:58.0
I.C.T has been working with suppliers to develop environmentally friendly lead-free solders and related materials and can now supply products that deliver high reliability. We also stand ready to work with customers in developing improved soldering materials and processes.Our objective is maximizing customer satisfaction by achieving the best possible quality and yield.
Industry News | 2015-03-30 18:56:47.0
The SMTA Capital Chapter is pleased to announce the officers for the 2015 term. Brian A. Costanzo of DRS Signal Solutions serves as President. Karen Walters Ebner of Raytheon Systems Company serves as Vice President. Bert Horner of The Test Connection, Inc. serves as Secretary. Fernando Rueda of Kyzen Corporation serves as Treasurer. Tom O'Connor of DfR Solutions serves as VP of Membership. Jessica Kreis of ZESTRON Americas serves as VP of Communications and Martin Anselm of Rochester Institute of Technology is the Board Liaison for the SMTA Capital Chapter.
Industry News | 2021-01-19 13:51:42.0
New Micro-Measurements Advanced Sensors Technology C4A Series Strain Gages Enable Easy, No-Solder Installation
Industry News | 2015-04-20 09:01:45.0
Rogers 4003c ,4 layer PCB assembly
Industry News | 2017-02-03 12:38:02.0
Exhibiting at a trade show can be a great way to create brand awareness and to meet our existing customers and potential buyers.
Industry News | 2014-08-12 11:23:03.0
Advanced Circuitry International is pleased to announce that we have aligned with Circuit Solutions, LLC to represent our RF/Microwave and Antenna PCB offering in the Mid-Atlantic region.
Industry News | 2020-12-10 14:08:30.0
Exxelia Temex' New CF & CFS Series Designed for Military Aircraft Ground Vehicles, Facilities Payloads Radars and Detection Naval Soldier Equipment
Industry News | 2007-11-27 12:13:09.0
FINEPLACER� Micro MA is a bonding platform characterized by an enlarged working space (max. substrate size 460 mm x 310 mm) combined with placement accuracy better than 10 micron. The system is suitable for small component assembly with a pitch down to 50 micron.
Industry News | 2009-07-14 17:50:29.0
Carlsbad, CA – July 14th, 2009: Machine Vision Products today announced it would be demonstrating the Ultra 850G Semiconductor, Packaging and MicroElectronics AOI solution at the Semicon West 2009 exhibition at the Moscone Center in San Francisco between 14th and 16th July at booth 743 in the South Hall.
