Industry News | 2019-04-30 17:39:40.0
The SMTA Capital Chapter and UP Media Group/Circuits Assembly Magazine are pleased to co-sponsor an amazing Chapter Tutorial Program. The tutorial will be held on June 11 and showcase the latest technologies, designs and reliability trends.
Industry News | 2020-10-12 15:09:12.0
Enables easier set-up and ensures accurate mix ratios by volume or weight to improve overall dispense quality ASYMTEK, a part of Nordson ELECTRONICS SOLUTIONS - a global leader in electronics manufacturing technologies, announces its latest technology has received the Global Technology Award 2020 for fluid dispensing equipment. Nordson Electronics Solutions developed the patent-pending software, Automated Ratio Calibration Technology (ARC™ Technology), to enable easier set-up and sustained mix ratios for dispensing two-component (2K) fluid materials. ARC Technology is part of a system, which includes ASYMTEK Vortik® progressive cavity pumps and ASYMTEK dispensing platforms, that ensures consistently accurate mix ratios by volume or weight to improve overall dispense quality. The award was announced by Global SMT & Packaging magazine during a virtual ceremony held on September 29, 2020.
Industry News | 2015-11-25 16:58:05.0
On behalf of the SMTA International Technical Committee, we invite you to submit a 300 word abstract of your research for the 2016 SMTA International 2016 technical conference in Rosemont, Illinois. Papers should describe significant results from experiments, emphasize new techniques, and contain technical, economic or appropriate test data. We are looking for papers on a variety of topics related to electronics manufacturing including advanced packaging/components, assembly, business/supply chain, emerging technologies, harsh environment applications, PCB technology, and process control. Materials must be original, unpublished and non-commercial in nature.
Industry News | 2020-12-01 17:14:52.0
Heralds Design-through-Manufacturing 4.0
Industry News | 2012-04-17 10:06:22.0
Practical Components Inc., a leading supplier of dummy components, introduces the Practical Dummy Component® version of pre-molded QFN packages.
Industry News | 2013-11-14 18:35:01.0
Barry Industries introduces their line of hermetically sealable HTCC Quad-Flat-No-Lead (QFN) packages with air cavity for high frequency applications. These QFN packages are available in six (6) sizes from 3mm to 8mm with standard JEDEC MO-220 footprints.
Industry News | 2015-03-16 06:51:04.0
Void Formation in Solder Joints – Causes & Cures Webinar Monday 18th May 2.30pm GMT Voiding in solder joints is not new we have experienced cavities in solder joints during the introduction of through hole, surface mount and more recently area array technology. In many cases we never knew we have had voids till the introduction of x-ray inspection.
Industry News | 2016-10-20 20:04:53.0
Techcon Systems is pleased to announce the introduction of the new TS8100 Series Positive Displacement PC Pump. The continuously volumetric dispense pump is based on Progressive Cavity (PC) technology.
Industry News | 2016-10-24 16:09:49.0
Techcon Systems will exhibit in Booth #345 at The ASSEMBLY Show, this week from Oct. 25-27, 2016 in Rosemont, IL. The team will demonstrate the new TS8100 Series Positive Displacement PC Pump, along with its dispensing robots. The continuously volumetric dispense pump is based on Progressive Cavity (PC) technology.
Industry News | 2003-02-14 08:03:50.0
Provides Devices with Excellent Protection Against EMI and Overcomes Limitations of Metal Cans
winsouce.jpg)