Industry News: chip on board process (Page 1 of 78)

Deep Micro-vias Available on Large-format PCBs

Industry News | 2003-02-25 08:18:29.0

Teradyne can now provide deep micro-via technology for customers of high-performance printed circuits.

SMTnet

Sales and Result Improved: VOGT electronic on the Right Course

Industry News | 2003-05-29 08:30:31.0

Losses halved in the first half year � New organization of electronics group next on the agenda

SMTnet

Altium Unveils New �Board-on-Chip� Technology

Industry News | 2003-04-30 08:37:19.0

Altium to preview industry-first technology at Programmable World that allows engineers to use board-level methodologies to design and implement embedded systems on FPGAs

SMTnet

Tessera Introduces PYXIS� Packaging Technology - World's First Chip-Scale Packaging Solution for Highly Integrated RF Modules

Industry News | 2003-04-15 08:57:18.0

First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies

SMTnet

Legacy Electronics Receives U.S. Patent for 3-D Memory Module with Canopy-type Carriers

Industry News | 2003-05-30 08:26:20.0

The inventors of this module type and holders of the patent are chief technical officer Kenneth J. Kledzik and president Jason C. Engle, both of San Clemente, California.

SMTnet

University Pioneers Assembly Technolology

Industry News | 2003-03-28 08:24:43.0

The manufacture of electronic devices could be revolutionised thanks to assembly research being pioneered at the University of Greenwich.

SMTnet

SMTA International Focuses on Package-on-Package

Industry News | 2011-08-24 22:37:23.0

The SMTA announced that it will hold sessions and a tutorial on Package-on-Package (PoP) surface mount stacking at their annual conference, SMTA International, taking place October 16-20, 2011 in Ft. Worth, Texas.

Surface Mount Technology Association (SMTA)

Call For Presentations: IPC Conference on Assembly Reliability

Industry News | 2011-04-01 13:21:14.0

IPC invites researchers, academics, technical experts and industry leaders to submit abstracts for the IPC Conference on Reliability: Assembly Process for a Reliable Product, November 1–2, 2011 in Irvine, Calif. Focused on reliability issues arising at the assembly level, the conference will highlight new developments in materials, process and test.

Association Connecting Electronics Industries (IPC)

IPC-4204A Provides Guidance on High Speeds and Fine Lines

Industry News | 2012-06-01 13:55:57.0

As chip speeds skyrocket and system sizes diminish, designers and manufacturers face new and complex challenges

Association Connecting Electronics Industries (IPC)

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chip on board process searches for Companies, Equipment, Machines, Suppliers & Information

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