Industry News | 2013-10-28 16:31:54.0
IPC Conference on Solder and Reliability: Materials, Processes and Tests, November 13–14 in Costa Mesa, Calif.
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2018-05-16 11:45:10.0
ACL introduces dissipative finger cots to its static control offerings for ESD applications including those that require chemical resistance. Available in latex and nitrile varieties, these finger cots are designed for manufacturing in S20.20 EPAs, ISO 5 and Class 100 Clean Rooms, and for manufacturing Class II static sensitivity devices.
Industry News | 2020-07-16 12:28:05.0
A quick determination of a stencil wiping roll's ability to withstand fiber detachment and consequent contamination of circuit boards during the printing process
Industry News | 2019-05-22 11:33:05.0
While no material is entirely lint-free, there are materials that are virtually lint-free. This is an important attribute to look for in your stencil wiping roll. Contaminated PC boards are a common problem. While the contamination itself is often thought of as a mystery to the printer operator, the cause may come from the stencil wiping roll. This is largely due to the sticky solder paste and sharp edges of the stencil’s apertures.
Industry News | 2019-05-22 11:33:07.0
While no material is entirely lint-free, there are materials that are virtually lint-free. This is an important attribute to look for in your stencil wiping roll. Contaminated PC boards are a common problem. While the contamination itself is often thought of as a mystery to the printer operator, the cause may come from the stencil wiping roll. This is largely due to the sticky solder paste and sharp edges of the stencil’s apertures.
Industry News | 2019-11-05 22:19:03.0
> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.
Industry News | 2015-03-20 05:30:21.0
A Full Range of DDR4 UDIMM and SO-DIMM Modules Available for the Next Generation of Embedded
Industry News | 2020-06-24 15:27:46.0
Austin American Technology (AAT) is pleased to offer the Mega ION® cleaning system designed for solvent based, high reliability applications requiring product cleanliness verification (IPC ROSE Testing). It is used for final clean prior to conformal coat, encapsulation or other sealing operations used to protect electronic modules.
Industry News | 2011-10-21 13:18:46.0
AIM announces that its Mexican facility, Soldadura de Mexico, has received its Clean Industry Certification.
