Industry News | 2010-03-30 13:55:49.0
NASHVILLE - Kyzen, the world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that Dr. Mike Bixenman will present a paper titled "OA Flux Cleaning Studies on Highly Dense Advanced Packages Parameters" at the upcoming IPC/APEX conference and exhibition.
Industry News | 2021-09-30 16:47:52.0
KYZEN is pleased to announce that it will exhibit at the High Reliability Cleaning and Conformal Coating Conference, scheduled to take place Oct. 5-7, 2021 in Dallas, TX. KYZEN will highlight the AQUANOX A4727Next Generation Aqueous Assembly Cleaner.
Industry News | 2024-09-16 18:36:04.0
SHENMAO America, Inc. is proud to introduce its latest innovation in response to the rising demand for ultra-thin electronic packages. As package thinness increases, issues like package warpage and its detrimental effects on production yield have become critical challenges. SHENMAO is addressing these concerns with its new Low-Temperature Solder (LTS) materials, which are engineered to lower reflow temperatures, mitigating PCB and substrate deformation while enhancing overall yield rates.
Industry News | 2017-03-21 09:58:44.0
Aqua Klean Systems today announced that CONCISYS has selected its award-winning Typhoon T-8 Chemistry Zero-Discharge Cleaner. With headquarters in San Diego, CONCISYS is the area’s premier SMT EMS provider.
Industry News | 2016-03-30 08:19:13.0
FCT Assembly has formulated a unique halogen-free water soluble flux with high activity and neutral pH. FCT's 159HF is a highly versatile solder flux formulated to perform under high temperatures and is compatible with both leaded and lead free alloys. With the low solids content of 159HF, the water soluble flux is applicable in selective; drop-jet spray soldering applications while also being ideal for wave soldering. Because the flux stays active under critical temperatures during pre-heat and wave, 159HF performs exceptionally well in high temperature applications, especially with manufacturers using multilayer boards with lots of heat sink resulting in improved topside fill.
Industry News | 2015-01-25 15:34:37.0
Aqua Klean Systems will exhibit in Booth #607 at the 2015 IPC APEX EXPO, scheduled to take place Feb. 24–26, 2015 at the San Diego Convention Center. Aqua Klean Systems will exhibit the Typhoon T-8 Chemistry Cleaner, T-15, T-12, and T-9 Water Soluble Cleaners. Aqua Klean also will launch its new Ultra Sonic stencil cleaner product at the show.
Industry News | 2018-03-01 19:44:00.0
MicroCare Corp. stunned the PCB cleaning industry with a flurry of innovation at the massive IPC APEX EXPO in San Diego, CA this week with the launch of ten new cleaning products. Featured among these developments are popular flux-cleaning chemistries in a new, super-convenient, pocket-sized cleaning pen package. The new range features three formulations: the No-Clean Flux Remover, the RMA Flux Remover, and the Water-Soluble Flux Remover Pens. These three new cleaners have been designed to specifically remove fluxes quickly and safely and ensure PCBs will enjoy a long and productive life at the lowest possible cost.
Industry News | 2017-03-15 15:02:54.0
Aqua Klean Systems today announced that Amptech, Inc. has purchased a T-8 Chemistry Cleaner, T-12 Water Soluble Cleaner, and a Closed-Loop DI Recirculating System. Amptech is headquartered in Manistee, MI with plant operations in Michigan and Pennsylvania.
Industry News | 2015-10-22 16:43:19.0
SHENMAO SMF-WB02 / SMF-WB51 Water Soluble Flux are made locally in the USA and with the same quality in 7 other worldwide locations. It is said their Low Viscosity (easy to apply), High Tackiness (slump resistant), consistent printability for BGA and Micro BGA Ball Assemblies and excellent wash ability after high temperature reflow (255ºC and 60 sec over 220ºC) create highly reliable Solder Joints with optimum maximized Quality.
Industry News | 2016-05-24 20:29:22.0
SHENMAO SMF-WB02 / SMF-WB51 Water Soluble Flux are made locally in the USA and with the same quality in 7 other worldwide locations. It is said their Low Viscosity (easy to apply), High Tackiness (slump resistant), consistent printability for BGA and Micro BGA Ball Assemblies and excellent wash ability after high temperature reflow (255ºC and 60 sec over 220ºC) create highly reliable Solder Joints with optimum maximized Quality.
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