Industry News: cold solder inductor (Page 5 of 8)

X Marks the Spot for Solderstar's New Datalogger at SMTconnect

Industry News | 2022-03-25 12:40:21.0

Since launching at the end of last year, Solderstar's innovative new thermal profiler 'SLX' has gone from strength to strength thanks to its innovative new additions which will be showcased during SMTconnect Nuremberg from 10-12 May 2022 Hall 4 Stand 226.

Solderstar

X Marks the Spot for Solderstar's New Datalogger at SMTconnect

Industry News | 2022-03-25 12:40:48.0

Since launching at the end of last year, Solderstar's innovative new thermal profiler 'SLX' has gone from strength to strength thanks to its innovative new additions which will be showcased during SMTconnect Nuremberg from 10-12 May 2022 Hall 4 Stand 226.

Solderstar

FCT Assembly to Display Advanced Solder Pastes and Stencil Technology at SMTAI 2009

Industry News | 2009-09-17 15:08:48.0

GREELEY, CO —FCT Assembly announces that it will debut four new solder pastes and showcase its breakthrough UltraSlic™ FG solder paste stencil in booth 417 at the upcoming SMTA International conference & exhibition, scheduled to take place October 6-7, 2009 at The Town and Country Resort and Convention Center in San Diego.

FCT ASSEMBLY, INC.

Nihon Superior to Introduce the Newest Addition to the SN100C Lead-Free Solder Series at SMTAI 2011

Industry News | 2011-09-21 12:22:09.0

Nihon Superior will introduce the newest addition to its SN100C lead-free solder series, in Booth #310 at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX.

Nihon Superior Co., Ltd.

Nihon Superior to Exhibit Advanced Soldering Materials at INTERNEPCON JAPAN 2011

Industry News | 2011-01-14 13:06:07.0

Nihon Superior Co. Ltd. will exhibit in Booth # East 30-14 at the upcoming INTERNEPCON JAPAN, scheduled to take place January 19-21, 2011 at the Tokyo Big Sight in Tokyo, Japan.

Nihon Superior Co., Ltd.

Nihon Superior to Showcase Advanced Soldering Materials at IPC APEX EXPO 2011

Industry News | 2011-03-14 17:59:18.0

Nihon Superior Co. Ltd. will exhibit in Booth #259 at the upcoming IPC APEX EXPO, scheduled to take place April 12-14, 2011 at the Mandalay Bay Resort & Convention Center in Las Vegas.

Nihon Superior Co., Ltd.

PNC Inc.’s BGA Assembly

Industry News | 2017-03-23 11:33:40.0

Outline of PNC Inc's BGA assembly capabilities.

PNC Inc.

Rehm Thermal Systems’ Managing Director is “Manager of the Year 2016”

Industry News | 2016-07-05 17:56:13.0

Altus are delighted to report another milestone for our principal, Rehm Thermal Systems, manufacturer of world leading conventional and condensation reflow systems and curing and conformal coating solutions.

Altus Group

Kester Introduces EnviroMarkTM 923 Lead-Free Halogen-Free No-Clean Solder Paste at NEPCON China, Shanghai.

Industry News | 2008-04-07 20:17:14.0

ITASCA, IL � February 29, 2008 � Kester announces it will showcase EnviroMark 923 (EM923), a halogen-free, RoHS Compliant lead-free no-clean solder paste, in booth 2C04 at the upcoming NEPCON China/EMT China 2008 exhibition and conference -scheduled to take place April 8-11, 2008 in Shanghai, PR China.

Kester

Kester to Feature Lead-Free Information Center at APEX 2008

Industry News | 2008-02-29 16:42:42.0

ITASCA, IL � January 7, 2008 � Kester will provide lead-free resources, technologies and products in booth 1660 at the upcoming APEX 2008 exhibition and conference, scheduled to take place April 1-3, 2008, in Los Vegas.

Kester


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