Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2010-04-10 02:07:54.0
IPC has released the E revision of IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies. Recognized worldwide as the sole industry-consensus standard for soldering processes and materials, IPC J-STD-001E encompasses advanced technologies and provides new and updated criteria for all three classes of construction as well as expanded support for lead-free manufacturing.
Industry News | 2020-02-18 14:13:29.0
Michael Ford, Dale Lee, Joe O’Neil and S. Manian Ramkumar honored for their on-going leadership in IPC and the electronics industry
Industry News | 2011-09-19 13:31:20.0
STI Electronics introduces its new Micro-Coil Spring Array as an improved alternative to standard rigid arrays.
Industry News | 2021-04-01 08:18:33.0
TopLine Corporation has been granted US patent 10,937,752 for Lead Free Solder Columns for Column Grid Array Substrates. TopLine holds 7 patents in the field of Column Grid Arrays, also known as CCGA.
Industry News | 2011-11-20 12:48:27.0
STI Electronics has been awarded a Global Technology Award in the category of Components for its Micro-Coil Spring Array.
Industry News | 2017-01-29 09:37:08.0
TopLine will exhibit its MSC Series of Micro-coil springs, a novel interconnect for CCGA (Ceramic Column Grid Array) IC packages for harsh environments. In tests using daisy chain test vehicles, Micro-coil springs absorbed extreme shock of up to 50,000g before failing. Commercial applications include aerospace, avionics, military, down-hole oilfield drilling and automotive electronics. Test results were initially presented at IEEE CPMT 2012.
Industry News | 2020-11-17 11:26:03.0
TopLine Corporation will exhibit in the 58th annual IEEE Nuclear and Space Radiation Effects Conference (NSREC), which will have its first Virtual Conference and Exhibition beginning November 29 and accessible through December 30. Live virtual Exhibits will be accessible December 1-8.
Industry News | 2018-03-13 18:47:01.0
TopLine will once again be the premier sponsor of the upcoming IMAPS Wire Bonding Conference. In making the announcement, TopLine CEO Martin Hart stated that he is delighted to support the conference as the leading sponsor for the second time. The Wire Bonding workshop and tabletop exhibition will be held October 8, 2018 in California at the Pasadena Convention Center. The event is co-located with the IMAPS 51st Symposium on Microelectronics.
