Industry News | 2019-04-23 08:08:27.0
Saki Corporation announces the release of its new 2Di-LU1 inline bottom-side automated optical inspection (AOI) system at NEPCON China, Shanghai, China, and SMTconnect, Nuremberg, Germany. Saki's 2D line-scan technology is ultra-fast, capturing the image of an entire 460x500mm printed circuit board assembly (PCBA) and carriers of 610x610mm in one pass, in real time, storing the image into memory, and creating inspection data for the entire board.
Industry News | 2001-08-01 16:03:56.0
Next Generation Embedded Frame Grabber
Industry News | 2019-08-28 00:00:21.0
Saki Corporation will exhibit its 2Di-LU1 2D bottom-side automated optical inspection (AOI) system at NEPCON Asia along with its 3D AOI and solder paste inspection (SPI) systems and M2M capabilities for ensuring defect-free electronics for automotive and mobile applications. To demonstrate the speed and effectiveness of its 2D bottom-side AOI, Saki is collaborating with Ersa, Wertheim, Germany, to inspect the bottom-side of a printed circuit board assembly (PCBA) after Ersa's SMARTFLOW 2020 selective soldering process.
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