Industry News: company structure (Page 11 of 54)

Pulse Electronics' PIMinator Accessories Zero-In on DAS Network PIM Reduction

Industry News | 2016-05-11 19:33:19.0

Pulse Electronics Corporation introduces two unique and performance-enhancing installation options for its PIMinator® line of distributed antenna system (DAS) in-building ceiling-mount antennas. The DASACHOLDER is a sturdy, plastic, above-ceiling antenna holder that is easy to install, is hidden above the ceiling so it doesn't interfere with the aesthetics of the building, and does not induce passive intermodulation (PIM) in in-building installations. The DASACABSORBER attaches to the plastic holder or surrounding structures and helps mitigate the effects of PIM sources by absorbing reflections on cellular radio frequencies in the transmit and receive bands. The result is a confirmed reduction of PIM energy by as much as 40dB.

Pulse Electronics

Carve-out completed successfully: Siemens Electronics Assembly Systems adjusts to market situation; wants to become faster and more flexible

Industry News | 2009-01-30 18:35:31.0

Right on schedule, Siemens Electronics Assembly Systems (SEAS) became operational on January 1, 2009, as a legally separate company within the Siemens technology conglomerate. This step signalled the end of the carve-out process, which started in 2008. At the same time, the Siplace Excellence restructuring program, which was begun in 2007, is entering into a second phase that involves making certain volume-driven adjustments.

Siemens Process Industries and Drives

SCS to Present Parylene Nanostructures and Coatings at IMAPS Micro/Nano-Electronics Packaging & Assembly

Industry News | 2017-04-22 11:38:03.0

Specialty Coating Systems (SCS) is pleased to announce that it will exhibit at the 2017 IMAPS Micro/Nano-Electronics Packaging and Assembly (MiNaPAD) Forum, scheduled to take place May 17-18, 2017, in Grenoble, France, at the WTC congress center. The company will exhibit its industry-leading Parylene conformal coatings and SCS Vice President of Technology Rakesh Kumar, Ph.D. will present, “Parylene Nanostructures and Coatings for Electronics Applications.”

Specialty Coating Systems

Elcoteq Forms Joint Venture With Finnish PCB Firm

Industry News | 2002-04-15 09:16:07.0

To Develop Integrated Module Board (IMB) Technology Under a New Company Imbera Electronics Oy

Elcoteq Tallinn

Aegis Software appoints new Vice President of Sales Worldwide

Industry News | 2013-02-11 12:34:02.0

Aegis Software announces the appointment of Paul Price as Vice President of Sales Worldwide.

Aegis Industrial Software Corporation

Total 3D – Viscom Presents AOI Module with 3D Technology

Industry News | 2013-10-14 16:08:06.0

Productronica 2013, Hall/Stand A2-177 Established in 1984, Viscom has been developing innovative solutions for optical and X-ray inspection for almost 30 years.

Viscom AG

A-Laser Announces Speakers for MID Tech Day

Industry News | 2015-01-25 16:08:30.0

A-Laser is pleased to announce the panel of technical speakers who will be presenting on Laser Direct Structuring (LDS) and Molded Interconnect Devices (MIDs) during the FREE technical event on Thursday, Feb. 19, 2015 at its facility in Milpitas, CA.

A-Laser, Inc.

Lake Mary, FL USA � Mobile Phone Testers by Japan Radio Co. will be Supplied Through Test Equipment Connection based on New Sales Agreement

Industry News | 2008-09-25 09:18:06.0

Test Equipment Connection Corporation today announced the company has been chosen to sell new Japan Radio Co. mobile phone test equipment

Test Equipment Connection

MEMS Oscillators - Great Growth Potential and Superior Performance Multitest Equipment Fully Supports the Advantages

Industry News | 2012-12-04 13:42:40.0

Multitestannounces that its equipment fully supports the advantages of MEMS Oscillators.

Multitest Elektronische Systeme GmbH


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