Industry News: company structure (Page 39 of 54)

YXLON International’s FF70 CL 2D-3D X-ray Wins 2019 Global Technology Award

Industry News | 2019-11-13 11:53:45.0

YXLON International is pleased to announce that it has been awarded a 2019 Global Technology Award in the category of Inspection – X-ray for its YXLON FF70 CL highest resolution advanced 2D and 3D X-ray system. The award was presented to the company during a Tuesday, Nov. 12, 2019 ceremony that took place during productronica in Munich, Germany.

YXLON International

Krayden, Inc. Introduces Expanded New Line Card for 2009

Industry News | 2009-04-08 16:12:41.0

DENVER � April 2009 � Krayden, Inc., a leading distributor of engineered materials, introduces an updated and expanded line card, detailing its services and manufacturers.

Krayden Inc.

PCB Assembly Express Develops Next Generation Quoting and Ordering System

Industry News | 2012-02-07 10:42:18.0

PCB Assembly Express Provides Step-By-Step Virtual Quote Assistant and Instant Online Quoting & Ordering for Both U.S. & Offshore Assembly Services

PentaLogix

Adeon Software House Announces New BOMArchitect® That Enables BOM Processing In Hours Not Days

Industry News | 2013-02-08 23:21:38.0

Adeon Software House has announced a new software tool, BOMArchitect®, for the super fast, hassle-free, validation and processing of Bills of Materials (BOM). Developed to meet the needs of electronics manufacturers BOMArchitect replaces the time consuming and repetitive process of reviewing BOMs with a high-speed process that takes hours, rather than days; minutes, rather than hours.

Adeon Software House

Nordson EFD Launches Innovative P-Jet Non-Contact Jetting Technology for Higher Throughput Yields

Industry News | 2015-11-01 18:33:22.0

Nordson EFD introduces a new series of pneumatic non-contact dispensing systems. The P-Jet and P-Dot valves and V100 controllers jet low- to high-viscosity fluids with great precision and repeatability. They are designed for use in many types of applications and multiple industries including automotive, electronics, aerospace, and medical.

Nordson EFD

Puma/Tarantula - Essemtec‘s P&P/dispenser innovation at productronica

Industry News | 2017-10-16 19:59:28.0

Essemtec will present a large all-in-one platform that can be used for the assembly of high-speed applications, rapid prototyping and high-speed dispensing at productronica 2017. The company will exhibit in Hall A3, Booth 218, Nov. 14 – 17, 2017 at the Messe München in Germany. With different modules, the system can grow synchronously with customer requirements for performance and processes.

ESSEMTEC AG

Top 100 Award: Scheugenpflug among the Innovation Leaders 2019

Industry News | 2019-07-02 13:19:02.0

On June 28, 2019, Scheugenpflug AG was honored as a top innovator at the 6th German SME Summit for the first time. The TOP 100 seal of approval was presented in Frankfurt’s Jahrhunderthalle by author and science journalist Ranga Yogeshwar. Neustadt/Donau, July 1, 2019: At the 26th edition of the independent innovation competition TOP 100, Scheugenpflug AG for the first time made the leap among the best: On June 28, 2019, the specialist for adhesive bonding, dispensing and potting technology was honoured with the TOP 100 seal at the 6th German SME Summit. The award was presented by Ranga Yogeshwar, mentor of TOP 100, innovation researcher Prof. Dr. Nikolaus Franke and compamedia. Using a scientific system, TOP 100 evaluates the innovation management and the resulting innovation successes of medium-sized companies. The award ceremony took place in the Jahrhunderthalle in Frankfurt.

Scheugenpflug Inc.

Nihon Superior's Mr. Keith Sweatman to Present at the 2023 SMTA International Technical Conference

Industry News | 2023-10-02 10:02:23.0

Nihon Superior Co. Ltd. is pleased to announce that Keith Sweatman, the company's Senior Technical Advisor, will deliver a presentation titled "A Path to Ductile Low-Temperature Solders for Mass Production of Electronic Assemblies" at the upcoming SMTA International conference and exposition. This prestigious event is scheduled to take place Oct. 9-12, 2023 at the Minneapolis Convention Center in Minneapolis, MN. Keith Sweatman's presentation is scheduled within session LTS4, titled "Effects of Elemental Additions to Sn-Bi solder Alloys," and will take place on Thursday, Oct. 12, 2023, from 8:30 to 10:00 a.m.

Nihon Superior Co., Ltd.

Heraeus Printed Electronics and SUSS MicroTec Join Forces to Revolutionize High-Volume Semiconductor Manufacturing with Inkjet Technology

Industry News | 2024-03-11 14:54:34.0

Heraeus Printed Electronics GmbH and SUSS MicroTec have announced the signing of a Joint Development Agreement (JDA) to pave the way for digital inkjet printing of metallic coatings for semiconductor manufacturing. The partnership combines the core competences of both companies to enable digital printing solutions for mass production in the electronics industry for the first time.

Heraeus


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