Industry News: component terminations for rf applications (Page 7 of 8)

Video Demonstration for HIOKI 1240 Flying Probe Tester with New Software Programming Feature Is Now Live on Seika TV

Industry News | 2013-04-18 11:08:20.0

Seika Machinery, Inc., announces that it has added a video demonstration of the HIOKI 1240 Flying Probe Tester with the new software programming feature to Seika TV.

Seika Machinery, Inc.

Lattice Semiconductor Announces Video Display Interfaces Suite for HDMI, DVI, and 7:1 LVDS

Industry News | 2010-09-28 12:18:33.0

Lattice Semiconductor Corporation (NASDAQ: LSCC) today announced the immediate availability of a comprehensive video display interfaces suite for High-Definition Multimedia Interface (HDMI 1.3a), Digital Visual Interface (DVI), and 7:1 LVDS Interface. All of these display interfaces are available as free Reference Designs for the award winning, mid-range LatticeECP3™, while selected free Reference Designs can also be ported to the LatticeECP2M™ and LatticeXP2™ FPGA families.

Lattice Semiconductor

The necessity of X-ray inspection for SMT BGA soldering quality control

Industry News | 2021-06-10 02:42:13.0

With the advent of 5G, especially the high integration, high density, miniaturization of packaging, and high process requirements in the electronics industry, detection efficiency is particularly important. Many manufacturers are not particularly clear about what role X-Ray can play and how to use X-Ray to improve the process and reduce the defect rate. Most manufacturers buy X-Ray because of the needs of customers. Those who are forced to buy X-Ray alone do not actually understand the important role that X-Ray can play in the production line.

Unicomp Technology Co., Ltd

Averatek to Present "Surface Treatment for Soldering Aluminum PCBs to Conventional Copper PCBs" at IPC APEX EXPO

Industry News | 2021-10-31 04:57:58.0

Averatek is pleased to announce that VP of Manufacturing Divyakant Kadiwala will present the paper entitled, "Surface Treatment for Soldering Aluminum PCBs to Conventional Copper PCBs" during the IPC APEX EXPO Technical Conference, scheduled to take place Jan. 22-27, 2022 at the San Diego Convention Center in California. The paper was co-authored by Nazarali Merchant, Ph.D., Senior Materials Scientist for Averatek.

Averatek Corporation

Averatek to Present "Surface Treatment for Soldering Aluminum PCBs to Conventional Copper PCBs" at IPC APEX EXPO

Industry News | 2022-01-03 07:38:59.0

Averatek is pleased to announce that VP of Manufacturing Divyakant Kadiwala will present the paper entitled, "Surface Treatment for Soldering Aluminum PCBs to Conventional Copper PCBs" during the IPC APEX EXPO Technical Conference, scheduled to take place Jan. 22-27, 2022 at the San Diego Convention Center in California. The paper was co-authored by Nazarali Merchant, Ph.D., Senior Materials Scientist for Averatek.

Averatek Corporation

New Yorker Electronics Releases Gowanda Electronics' Expanded Broadband Conical Line

Industry News | 2021-02-03 09:05:21.0

New Gowanda Broadband Conical Configurations Designed to Enhance Utility in Electronics Design

New Yorker Electronics

Preview for Seica SMT Nuremberg April 26-28, 2016, booth # 7A.425

Industry News | 2016-04-04 11:35:00.0

The theme for Seica at SMT this year will be automation and Industry 4.0. Highlights will include the traditional Compact line of bed of nails and functional testers; the Pilot line, a truly versatile and multi-faceted flying probe system, and the Firefly line, a premier laser selective soldering system.

SEICA SpA

Lattice Announces Five New IP Suites for the LatticeECP3 FPGA Family

Industry News | 2011-02-07 15:59:43.0

Lattice Semiconductor Corporation today announced the immediate availability of five new comprehensive Intellectual Property (IP) Suites to accelerate the design of electronic systems in a variety of industries using the award winning LatticeECP3™ FPGA family.

Lattice Semiconductor

EE Technologies Selects DEK Horizon 03iX for Showcase Rapid Prototype Line

Industry News | 2010-06-28 17:29:55.0

Expanding on its seven existing SMT lines, Reno, Nevada-based contract manufacturer EE Technologies (EET) recently added a state-of-the-art eighth assembly line specifically to showcase its unique approach to rapid prototype production. Having had a very positive experience with the DEK printers in its other seven lines, EET again choose DEK and has installed the company’s latest technology, a Horizon 03iX platform, to extend its rapid prototype capability.

ASM Assembly Systems (DEK)

W. L. Gore & Associates, Inc., Agilent Technologies, and Mitel Agree to Common Standard for 12 Channel Parallel Optic Modules

Industry News | 2001-02-12 09:01:16.0

W. L. Gore & Associates, Agilent Technologies, and Mitel Corporation today announced that they have signed a Multi-Source Agreement (MSA) that will set the industry standard for next-generation parallel fiber optic modules. The three companies have leveraged their wide range of experience in fiber optic and semiconductor technologies to standardize the package and optical and electrical interfaces for their respective modules to ensure that customers will have access to multiple international sources that are compatible with other components within their systems. Each of the companies expects to offer the modules in 2001.

Agilent Technologies, Inc.


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