Industry News | 2013-03-19 15:13:22.0
Dr. Choon Lee, senior vice president, Amkor Technology, and a leading expert and innovator in the field of packaging technology, will reveal their strengths and weaknesses during his keynote, “System Integration Challenges in Packaging,” at IPC Electronic System Technologies Conference & Exhibition (ESTC), on May 22, 2013.
Industry News | 2020-01-30 09:45:27.0
Embedded World 2020: ARIES Embedded Integrates Industry’s First Multi-Core RISC-V System-on-Chip FPGA
Industry News | 2016-01-22 11:30:09.0
The greater visibility of ASSET® InterTech’s SourcePoint™ software debugger now enables engineers to quickly find the root causes of bugs in complex multithreaded code running on AppliedMicro®’s 64-bit ARM®-based HeliX® 2 family of system-on-a-chip (SoC) devices for the embedded market.
Industry News | 2011-05-06 21:39:30.0
Kyzen announces that Phil Zhang, its China Sales Manager, will present twice during the upcoming SMTA China East conference, which is being held in conjunction with NEPCON China 2011.
Industry News | 2015-08-25 12:54:07.0
ADLINK Technology today announced the release of its new Intelligent IoT Gateway Starter Kit. The IoT Gateway Starter Kit simplifies device-cloud connection, accelerates IoT application development, and speeds deployment for a wide variety of application environments such as industrial automation, smart buildings, smart parking systems, and agriculture.
Industry News | 2015-01-21 19:22:50.0
Nordson YESTECH, a subsidiary of Nordson Corporation (Nasdaq: NDSN) will showcase their FX-940 Automated Optical Inspection (AOI) In-line PCB inspection system and BX AOI benchtop system in Booth #1101 at the IPC APEX EXPO, scheduled to take place Feb. 24-26, 2015 at the San Diego Convention Center in California. Customers are invited to bring a sample to Nordson YESTECH’s inspection experts for review on these systems.
Industry News | 2015-10-13 14:07:18.0
Goepel is pleased to announce their latest webinar, "3D Circumference Inspection for Connector Insertion - Quality Control of Plug-in Contacts using 3D Measurement Method" on Tuesday, October 27th.
Industry News | 2011-02-14 14:35:18.0
Christopher Associates/Koki Solder announces that Jasbir Bath, Consulting Engineer, will give a presentation about Head-in-Pillow Component Soldering Defects at the upcoming LA/O.C. SMTA Chapter Dinner, scheduled to take place Thursday, February 17, 2011 at JT Schmid’s Restaurant & Brewery in Anaheim, CA at 7 p.m.
Industry News | 2016-08-31 19:01:58.0
Nordson YESTECH will exhibit in Booth #606 at SMTA International, scheduled to take place September 27-28, 2016 at the Donald Stephens Convention Center in Rosemont, IL. The YESTECH team will demonstrate the FX-940 ULTRA 3D AOI with cutting-edge 3D technology for the inspection of solder defects, lead defects/lifted leads, component presence and co-planarity of chips, BGAs and other height sensitive devices.
Industry News | 2017-01-11 18:30:41.0
Nordson DAGE, Nordson MATRIX, and Nordson YESTECH, divisions of Nordson Corporation will exhibit in Booth #1510 and 1511 at the 2017 IPC APEX EXPO, scheduled to take Feb. 14-16, 2017 at the San Diego Convention Center in California. Test and inspection solutions from Nordson DAGE, Nordson MATRIX and Nordson YESTECH will be demonstrated at the event.
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
2481 Hilton Drive
Gainesville, GA USA
Phone: (770) 538-0411
