Industry News | 2018-10-18 11:08:03.0
Different Techniques for Plating
Industry News | 2013-01-02 16:01:34.0
A Convenienient and informative online tutorial about Design and Assembly Process Challenges for Bottom Terminations Components
Industry News | 2009-02-21 17:56:00.0
BANNOCKBURN, Ill. and ARLINGTON, Va., USA, February 19, 2009 � IPC � Meeting the requirements of RoHS (restriction of the use of certain hazardous substances in electrical and electronic equipment) compliance and successfully implementing lead-free electronics assembly processes is an ongoing challenge for the electronic interconnect industry. To help companies work toward their compliance goals, IPC and JEDEC present �Transitioning to Lead Free � Strategies for Implementation,� a three-day conference to be held March 3�5, 2009 in Santa Clara, Calif.
Industry News | 2010-12-10 12:27:00.0
Ironwood Electronics recently introduced a new spring pin socket addressing precise resistance measurement need for testing power management devices - SSK-QFN-7000.
Industry News | 2017-01-17 15:39:40.0
STI Electronics today announced that it has been selected to receive the “Best of Conference” award for a paper presented during SMTA International in September. The paper entitled “BTC/QFN Test Board Design Considerations and Method for Qualifying Soldering Materials and Cleaning Processes” was co-authored by Dr. Mike Bixenman of KYZEN, and Mark McMeen and Jason Tynes from STI Electronics.
Industry News | 2008-11-25 16:50:00.0
Release Date: 1-Nov-2008
Industry News | 2019-08-15 07:31:59.0
AXI is short for automated X-ray inspection, it's one of the most commonly used approaches for defect inspection in PCB Assembly.
Industry News | 2012-04-17 10:06:22.0
Practical Components Inc., a leading supplier of dummy components, introduces the Practical Dummy Component® version of pre-molded QFN packages.
Industry News | 2008-11-18 17:22:43.0
Moulded Interconnected Device (MID) applications are the current focus of the automotive and medical device industries. In such products, circuits are directly applied onto the surface of injection moulded plastic parts or are integrated as part of products. In a 3D-MID, SMD components typically are on multiple levels. Essemtec has developed a system that can dispense and place in three dimensions and is capable of placing 3D-MID technology.
Industry News | 2021-06-11 03:10:46.0
More and more customers switch their SMT BGA QFN soldering quality from X-ray sampling check to 100% fully inline inspection to guarantee its products quality, previously only in automotive, medical, military and aerospace industries, nowadays also applied into high-end consumer electronics PCBA assembly.
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