Industry News: copper area (Page 3 of 14)

Hampoo Electronics Participated in Embedded World 2016

Industry News | 2016-03-09 04:47:28.0

February 23th-25th, Hampoo Electronics attended the Embedded World 2016 in Convention and exhibition center in Nuremberg, Germany. We have made great progresses in market expending, service promotion, collaborators communication and image building.

Hampoo Science & Technology Co., Ltd

Nihon Superior to Display Complete Range of SN100C Soldering Materials at SMTA International 2008

Industry News | 2008-08-07 15:26:07.0

Nihon Superior will feature a new, expanded range of SN100C products with FCT Assembly, one of its US SN100C Global Partners, in booth 125 at the upcoming SMTA International exhibition and conference.

Nihon Superior Co., Ltd.

Yash Sutariya to Present at IPC Technology Interchange on Thermal Management: Getting the Heat Out

Industry News | 2010-09-30 17:36:09.0

Presentation entitled "Thermal Management in End Applications: Dissipating the Heat Away from the Base of LEDs" to address material specifications for Metal Core / Aluminum PCBs for LED Applications.

Saturn Electronics Corporation

KDPOF Celebrates IEEE 802.3cz-2023 Standard for Automotive Multi-gigabit Ethernet over Fiber Optics

Industry News | 2023-06-07 09:02:31.0

New standard defines Physical Layer specifications and management parameters for multi-gigabit glass optical fiber automotive Ethernet

KDPOF

Resin plug application and process

Industry News | 2019-05-16 01:24:13.0

With the development of miniaturization of assembly components, the layout area and pattern design area of PCBs have also been continuously reduced, and PCB manufacturers are constantly updating the production process to conform to the development trend. The application of the resin plugging process has also become more and more extensive, and it has been used in HDI panels.

Headpcb

Hesse Mechatronics to Demonstrate Wedge Wire Bonding Capabilities at Productronica

Industry News | 2013-10-31 11:53:09.0

Hesse GmbH will demonstrate a full range of wedge wire bonding capabilities at Productronica, taking place November 12-15 in Munich, Germany, in Hall B2, Booth 255.

Hesse Mechatronics

Balver Zinn Acquires Global License for Nihon Superior Co. Ltd.�s SN100C Solder Paste and Wire

Industry News | 2007-12-05 23:40:50.0

BALVE, GERMANY � December 4, 2007 � The Balver Zinn Group, a leading provider of high-quality anodes with various alloys as well as soft solders and special wires, announces that it is positioning itself to develop the opportunities presented by the global license it has acquired for solder pastes and wire using the proven SN100C alloy developed by Nihon Superior Co. Ltd.

Balver Zinn

NCAB Group USA’s Quality Manager Discusses PCB Cost Drivers at SMTA Space Coast Chapter Technical Luncheon

Industry News | 2015-09-22 21:04:29.0

NCAB Group is pleased to announce that its Quality Manager Holly Freve presented at the SMTA Space Coast Chapter September Technical Luncheon on Wednesday, Sept. 16, 2015 at Mack Technologies in Melbourne, FL. Ms. Freve presented “Cost drivers in PCB production.” She offtered an in depth discussion about board size, layer count, copper weight, manufacturing yield, and more factors that drive costs in PCB production.

NBS Design, Inc.

Essemtec’s Technology Day to Highlight Future Dispensing and MID Technologies

Industry News | 2012-11-06 11:22:15.0

Dispensing and MID (Molded Interconnected Devices) technologies are developing rapidly. Current technology drivers are LED and communication products. On September 28th, Essemtec’s technology day focused on new developments and future challenges. The event was free of charge for all participants.

ESSEMTEC AG

Nihon Superior to Showcase Newly Expanded Range of SN100C Soldering Materials at Mexitr�nica 2008

Industry News | 2008-10-07 20:52:28.0

OSAKA, JAPAN � October 2008 � Nihon Superior USA, a subsidiary of Nihon Superior Co. Ltd., an advanced soldering supplier to the worldwide market, announces that it will feature a newly expanded range of SN100C products, which includes new halogen-free solder paste, in booth 402 at the upcoming Mexitr�nica exhibition, scheduled to take place October 21-23, 2008 at the Expo Guadalajara, Hotel Hilton, in Guadalajara, Jalisco, M�xico.

Nihon Superior Co., Ltd.


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