Industry News | 2015-11-25 16:58:05.0
On behalf of the SMTA International Technical Committee, we invite you to submit a 300 word abstract of your research for the 2016 SMTA International 2016 technical conference in Rosemont, Illinois. Papers should describe significant results from experiments, emphasize new techniques, and contain technical, economic or appropriate test data. We are looking for papers on a variety of topics related to electronics manufacturing including advanced packaging/components, assembly, business/supply chain, emerging technologies, harsh environment applications, PCB technology, and process control. Materials must be original, unpublished and non-commercial in nature.
Industry News | 2022-01-14 17:06:40.0
Expanded technical conference award categories include NextGen and Student Research
Industry News | 2023-06-13 18:20:29.0
ZESTRON is pleased to announce an upcoming webinar on "Enhancing Performance of Copper Pillar Interconnects through Defluxing". The webinar will take place on June 15, 2023, at 2:00 PM EST and will be presented by Ravi Parthasarathy, Senior Application Engineer at ZESTRON Americas.
Industry News | 2023-03-06 17:22:53.0
ZESTRON, is pleased to announce that Senior Application Engineer, Ravi Parthasarathy, will present a technical study, "Defluxing of Copper Pillar Bumped Flip Chips" at the International Microelectronics Assembly and Packaging Society's (IMAPS) Device Packaging Conference on Tuesday, March 8th. His presentation is part of the Fan-Out, Wafer Level Packaging & Flip Chip Track Session TP2: WLP & Flip Chip: Process & Materials (2:00 – 5:30 pm)
Industry News | 2010-07-29 14:45:16.0
Henkel’s non-conductive paste (NCP) solutions have long enjoyed a leading market position for traditional Gold – Gold flip chip processes. Recent NCP innovations from the global materials leader are also now enabling next-generation, high I/O fine-pitch technologies including new copper pillar (Cu Pillar) interconnects.
Industry News | 2016-10-09 21:32:22.0
Topic: Study on a Formulated No Clean Flux for Fine-Pitch Flip Chip Package of Copper Pillar/ Micro-bump Interconnect. Time: October 18, 10:00 am – 1:30 pm Authors: Hsiang-Chuan Chen, Ya-Ching Chuang, Chia-Hao Chang, Watson Tseng
Industry News | 2022-12-26 11:34:19.0
ZESTRON is pleased to announce that ZESTRON's Senior Application Engineer, Ravi Parthasarathy will be presenting, "Process Considerations for Defluxing Ultra-Fine Pitch Die on CoWs", at IPC APEX 2023 taking place in San Diego, California.
Industry News | 2023-05-15 18:10:29.0
ZESTRON is proud to announce its latest webinar series, "Advanced Packaging and Power Electronics: A Webinar Series on the Latest Innovations, Cleaning, and Corrosion Challenges."
Industry News | 2016-09-12 20:17:12.0
Essemtec today announced plans to exhibit in Booth #224 at IMAPS Pasadena, scheduled to take place Oct. 10-13, 2016 at the Pasadena Convention Center. Essemtec will demonstrate the new compact Spider jet dispenser. The Spider can utilize two dispensing valves rated at up to 150,000 dots per hour. It dispenses 3D patterns and is easily adapted to your application.
Industry News | 2018-09-26 11:50:32.0
SHENMAO America, Inc. is pleased to introduce its SMF-UL51, which is a no-clean, halogen-free, ultra-low-residue spray flux. As the world’s major solder materials provider, SHENMAO produces SMT solder paste, laser soldering paste, cored solder wire, wave solder bar, semiconductor packaging solder spheres, wafer bumping solder paste, flux and solar PV ribbon.
