Industry News: cyberoptics se500 (Page 1 of 5)

SMTA China Announces 2012 Paper/Presentation Awards

Industry News | 2012-05-09 13:57:33.0

SMTA China announced the Best and Excellent Paper and the Best and Excellent Presentation and Best Exhibit Awards at its annual awards presentation held in conjunction with SMTA China Annual Breakfast Reception and Recognition Ceremony,

Surface Mount Technology Association (SMTA)

Hyundai Mobis Invests in CyberOptics’ SE500™ SPI System

Industry News | 2010-11-15 22:18:42.0

CyberOptics announces that Hyundai Mobis has invested in the SE500™ 100 percent 3-D solder paste inspection system for its Tianjin plant. Hyundai Mobis' investment totals approximately US$500K.

CyberOptics Corporation

PRIDE Industries Places Order for CyberOptics’ Flagship 3-D SPI System – the SE500™

Industry News | 2012-06-27 14:07:07.0

PRIDE Industries, Inc has purchased two SE500™ 3-D Solder Paste Inspection (SPI) systems for its manufacturing facility in Roseville, CA.

PRIDE Industries, Inc.

CyberOptics SE500ULTRA™ SPI Awarded for Excellence in the Asian Electronics Industry

Industry News | 2012-04-26 21:04:05.0

CyberOptics Corporation (Nasdaq: CYBE) announces that it has been awarded a 2012 EM Asia Innovation Award in the category of Test & Measurement / Inspection Systems – SPI for its SE500ULTRA™

CyberOptics Corporation

Viscom and CyberOptics Announce Cooperation Agreement for 3D Solder Paste Inspection Sensor Technology

Industry News | 2011-03-17 18:53:24.0

Viscom AG and CyberOptics jointly announce an OEM agreement to equip Viscom’s SPI inspection systems product line with CyberOptics’ 3D SPI sensor technology. The development and supply agreement allows for the integration of CyberOptics SE500 sensor technology into the Viscom PCB inspection platforms.

Viscom AG

CyberOptics to Officially Launch the SE500-D™ - SPI Dual-Lane System at NEPCON China 2011

Industry News | 2011-05-10 20:12:28.0

CyberOptics Corporation announces a new addition to its line of SPI solution, the Dual-Lane SE500-D™ system. The SE500-D™ will make its debut at NEPCON China 2011, making it the 5,501th system to be shipped from CyberOptics.

CyberOptics Corporation

CyberOptics to Launch Its Newest SPI Dual Lane System and Showcase Its Fastest AOI System at NEPCON China 2011

Industry News | 2011-04-27 19:41:30.0

CyberOptics Corporation announces that it will introduce SE500-D™ Dual Lane SPI system with largest board handling capability and also exhibit its award-winning QX500™ AOI system at NEPCON China 2011.

CyberOptics Corporation

CyberOptics to Premier SE500 � 3-D Solder Paste Inspection at APEX 2009

Industry News | 2009-03-10 18:41:17.0

MINNEAPOLIS - January 2009 - CyberOptics Corporation (Nasdaq: CYBE) announces that it will introduce SE500, an advanced 100 percent 3-D solder paste inspection system, in booth 2071 at the upcoming APEX 2009 exhibition and conference, scheduled to take place March 31-April 2, 2009 in Las Vegas.

CyberOptics Corporation

Viscom and CyberOptics Announce Cooperation Agreement for 3-D Solder Paste Inspection Sensor Technology

Industry News | 2011-04-07 11:39:03.0

Viscom AG, and CyberOptics, jointly announce an OEM agreement to equip Viscom's SPI inspection systems product line with CyberOptics' 3-D SPI sensor technology.

Viscom AG

CyberOptics' SE500 Sensor Integrated on Milara's TouchPrint TD2929 Inline Printer .

Industry News | 2010-04-10 23:26:32.0

MINNEAPOLIS - CyberOptics Corporation (Nasdaq: CYBE) announces that its 3-D post-print inspection head SE500 sensor has been integrated into Milara’s TouchPrint Digital TD2929 inline printer. The system will be on display at IPC/APEX 2010 in booth #959.

CyberOptics Corporation

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