Industry News: damp heat test (Page 15 of 40)

PDR Rework Releases Intelligent One-Touch Automated Thermal Process Control Software – Visit Booth #2753 at APEX

Industry News | 2017-01-15 19:48:37.0

PDR Americas today announced a new rework control package that reduces setup and changeover times effectively to zero and makes precision rework as simple as pushing a button. The ThermoActive+ Software will be demonstrated in Booth #2753 at the 2017 IPC APEX EXPO, scheduled to take place Feb. 14-16, 2017 at the San Diego Convention Center in Calif.

PDR-America

OptoTherm offers environmental enclosure for EL system

Industry News | 2008-05-30 10:22:55.0

OptoTherm offers environmental enclosure for EL system

OptoTherm, Inc.

BTU Receives Multi-Unit Orders for PYRAMAX™ Solder Reflow Ovens from SATS Companies

Industry News | 2012-02-07 16:22:03.0

BTU International announced the receipt of multiple orders for PYRAMAX™ solder reflow ovens from semiconductor assembly and test subcontractors (SATS) located in Asia. The orders are valued in excess of $1 million and shipments will be completed during the first half of 2012.

BTU International

Engineered Material Systems to Showcase Durable Printed Electronics at APEX

Industry News | 2017-01-15 19:01:19.0

Engineered Material Systems will exhibit its durable conductive inks, insulators and SMT adhesives in Booth #1222 at the IPC APEX EXPO, scheduled to take place Feb 14-16th in San Diego, CA. Durable inks and adhesives work well on traditional polyester film but also on pliable or stretchable substrates like thermoplastic urethane (TPU) or with ink heat-transfer systems.

Electronics Manufacturing Solutions (EMS)

STI Electronics Inc’s SIR Test Protocol Receives Prestigious Global Technology Award

Industry News | 2010-10-27 18:18:54.0

STI Electronics, Inc., a full service organization providing training, electronic and industrial distribution, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly, announces that it has been awarded a Global Technology Award in the category of Contract Services

STI Electronics

XYZTEC makes lid pull easy

Industry News | 2016-09-30 05:38:43.0

In this newsletter we describe a new method of testing the seal and adhesive quality of a lid encapsulated devices.

XYZTEC bv

Henkel Develops Thermally Conductive Technomelt® Solution

Industry News | 2016-03-30 09:04:09.0

Adding functional capability to its award-winning Technomelt® hot melt encapsulants, Henkel Adhesive Technologies today announced another formulation milestone with the development of a thermally conductive Technomelt material. With the ability to transfer heat through the encapsulating layer, thermally conductive Technomelt products offer dual-function performance in a single material solution.

Henkel Electronic Materials

One platform – many solutions. Preview for Seica Inc for Apex 2013, San Diego, February, booth 627

Industry News | 2013-01-30 13:06:03.0

Seica will be an exhibitor at the 2013 IPC APEX show being held in San Diego this year. Visitors are welcome to booth #627 to learn more about the industry leading ATE and functional test systems, an impressive array of the latest Seica product developments: The featured systems in booth #627 will include the Pilot V8 Flying Prober, the Firefly Laser Selective Soldering system, and the Compact TK Functional and In-Circuit Test system.

SEICA SpA

Nordson DAGE Wins A 2011 Global Technology Award for its 4000Plus Bondtester Pad Cratering Inspection System

Industry News | 2011-11-20 13:14:27.0

Nordson DAGE has been awarded a Global Technology Award in the category of Test Equipment for its 4000Plus Bondtester Pad Cratering Inspection System.

Nordson DAGE

Leading-Edge Auto-Alignment Concept: Multitest's MT2168 Features Superior Placement Accuracy

Industry News | 2011-09-01 21:06:44.0

Multitest announces that its MT2168 has proven its superior placement concept at a high-volume production site in Asia. The customer experienced a significant improvement in the placement rate of tested devices in the output tray.

Multitest Elektronische Systeme GmbH


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