Industry News: dead pad (Page 1 of 1)

Surface-mount technology

Industry News | 2018-10-18 09:15:23.0

Surface-mount technology

Flason Electronic Co.,limited

Saki Demonstrates XL 3D AOI System and On-the-Fly Debugging Software at SMTA International Booth 726

Industry News | 2016-09-22 18:12:16.0

Saki Corporation will demonstrate its BF-3Di-Z1 3D AOI system for extra-large (686x870mm) PCBs and easy-to-program real-time software in booth 726 at SMTA International, September 27 and 28th, 2016, being held at the Donald Stephens Convention Center, Rosemont, IL. Saki's 3D AOI systems measure heights from 0-20mm with 1µm resolution, measure the surface of surface mount devices and through-hole packages from all four directions without a dead angle or shadowing, and achieve full automation with very low false calls and zero escapes.

SAKI America

Vishay Siliconix Announces High-Speed Integrated MOSFET+Drivers

Industry News | 2006-02-24 16:25:58.0

New MOSFET+Drivers Provide Operation up to 1 MHz and 3 % Better Efficiency Than Discrete Solutions

Vishay Intertechnology, Inc.

Saki Demonstrates 3D AOI Systems at NEPCON South China Booth 1G35

Industry News | 2016-08-28 13:28:32.0

Saki Corporation will demonstrate its 2D and 3D automated optical inspection (AOI) systems at NEPCON South China in booth 1G35. Saki's AOI systems' unique Phase Measurement Profilometry technology and quad-directional side cameras inspect and measure QFNs, J-leads, and connectors, and enable the detection of the most difficult defects, such as lifted leads, tombstones, reverses, and height variations, without a reduction in speed. NEPCON South China is being held August 30-September 1, 2016 at the Shenzhen Convention & Exhibition Center, Shenzhen, China.

SAKI America

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