Industry News: die wlcsp (Page 1 of 1)

High Thermal Impact Reliability BGA Sphere from SHENMAO

Industry News | 2022-07-16 08:39:50.0

SHENMAO America, Inc. is pleased to announce that the PF918-S Lead-Free BGA Sphere features the newly designed high-reliability alloy PF918 that can achieve tensile strength performance 1.4 times higher than the typical SAC305 alloy.

Shenmao Technology Inc.

Henkel develops materials innovations for high power electronics

Industry News | 2012-04-27 19:07:14.0

Advances in power electronics are key to a sustainable energy future: Semiconductor power devices such as insulated gate bipolar transistors (IGBTs) deliver the high switching speeds which are critical for energy efficiency in electric cars, trains and other industrial applications. For the use of alternative energies, ultra-high efficiency and high-power density designs are imperative. Recognizing these market needs, Henkel has developed a comprehensive range of materials to further advance power electronics technology and will showcase these innovations from 8 to 10 May at SMT in Nuremberg.

Henkel Electronic Materials

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