Industry News | 2015-01-15 19:44:09.0
SMTA and Chip Scale Review magazine announced the best papers from the 2014 International Wafer-Level Packaging Conference (IWLPC.) Winners were selected from each of the three tracks covering Wafer Level Packaging, 3-D (Stacked) Packaging, and MEMS Packaging, as well as an overall Best Paper and Best of Conference winner. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging.
Industry News | 2010-06-28 16:44:36.0
The SMTA and Chip Scale Review magazine are pleased to announce the presentation line-up for the 7th Annual International Wafer-Level Packaging Conference. The IWLPC will be held October 11-14, 2010 at the Santa Clara Marriott Hotel in Santa Clara, California. Registration is now available on-line. Early Bird conference pricing is in effect until September 10, 2010, after which registration prices will go up $100.
Industry News | 2010-09-02 11:07:09.0
The SMTA and Chip Scale Review magazine are pleased to announce Peter Ramm, Fraunhofer EMFT, as the Opening Speaker at the 7th Annual International Wafer-Level Packaging Conference. The IWLPC will be held October 11-14, 2010 at the Santa Clara Marriott Hotel in Santa Clara, California.
Industry News | 2020-04-30 12:15:03.0
As the electronics industry continues to respond to new challenges emerging daily on COVID-19, IPC answered the industry's request to continue IPC certification and provide provisions for those individuals working from home offices.
Industry News | 2021-09-08 15:44:35.0
Singulating low volume tab routed PCBs to strict military specifications requires the right tool for the job. Now, with the benchtop PCB depaneling router from FKN Systek, applications requiring routing rather than punching are easily taken care of. This machine is also useful as a backup to high-speed programmable routers for short runs, and for separating thick back planes which cannot be singulated by other means.
Industry News | 2022-06-24 10:30:05.0
Abstracts due August 8
Industry News | 2013-11-05 23:02:54.0
Nordson ASYMTEK will introduce the Spectrum™ II at Productronica this year, marking the 6-year anniversary of the introduction of the Spectrum series of high-speed, high-accuracy dispensing platforms. The Spectrum II S2-900 Series leverages the same small footprint of 600mm x 1321mm as the original Spectrum to provide maximum productivity with minimum manufacturing floor space, but improves the precision, accuracy, and speed of the system to rival much larger platforms.
Industry News | 2018-10-18 09:06:41.0
Gold Fingers: A Guide to Understanding Gold-Plated PCB Connectors
Industry News | 2019-12-19 17:50:26.0
In a win for U.S. taxpayers, defense readiness, and the electronics industry supply chain, the U.S. House and Senate are poised this week to approve a defense spending bill that includes $5 million for research and development on the issues surrounding lead-free electronics in mission-critical applications.
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