Industry News: durastone for high temperature high strength (Page 1 of 53)

Easier Dispensing for Thermal Sealant

Industry News | 2003-02-24 09:32:24.0

Now available with an easy-to-use dispensing gun, Electrolube TCR is a single-component, highly thermally conductive RTV sealant.

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Long Life for Heatsink Thermal Tape

Industry News | 2003-07-02 08:54:26.0

A novel unreinforced, thermally conductive, pressure sensitive adhesive tape delivers very high bond strength to low-energy surfaces.

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More Capacity for Compact Electrolytics

Industry News | 2003-03-20 08:12:57.0

Nichicon has increased the top capacitance value of its WG series of surface mount electrolytic capacitors from 1000 to 1500uF.

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Evaluation Kit for Novel Board-to-board Jumpers

Industry News | 2003-03-04 08:08:23.0

In a move that broadens its interconnect design services, Micromark C and CD has introduced a new development kit for the Flexstrip jumpers flexible interconnect system.

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No Solder Required for Press-fit D-subs

Industry News | 2003-04-08 10:28:06.0

A new range of high-performance press-fit D-subminiature terminations from GTK can be fitted easily to PCBs without the need for solder.

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PCB Connectors Screw on for Security

Industry News | 2003-03-17 09:40:03.0

Omnimate BLZ/BLZF 5.08F PCB connectors have integral screwed flanges to ensure safe and secure connection under the most severe vibration conditions.

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Introducing Monarch Technologies Group: EDA Sales Force for Hire

Industry News | 2003-04-21 10:09:08.0

New Sales, Marketing Channel for Emerging EDA Companies

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Rogers Corp. Introduces R/flex� 3850 Bi-Clad Liquid Crystalline Polymer Material for Multi-layer Thin-Film PCB Construction

Industry News | 2003-06-24 08:14:51.0

R/flex� 3850 laminate is produced in a range of copper and LCP thicknesses, just as the single-clad laminate, and is available in standard panel formats.

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DuPont Electronic Technologies To Appoint Insulectro as National Distributor for Circuit Materials

Industry News | 2003-06-16 08:33:59.0

This action is part of the DuPont strategy to build on its leadership position in circuit materials, by expanding and strengthening the level of service and support available to its customers.

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Tessera Introduces PYXIS� Packaging Technology - World's First Chip-Scale Packaging Solution for Highly Integrated RF Modules

Industry News | 2003-04-15 08:57:18.0

First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies

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