Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2022-01-14 17:06:40.0
Expanded technical conference award categories include NextGen and Student Research
Industry News | 2018-10-18 08:00:40.0
SMT solder joint quality and appearance inspection process
Industry News | 2018-10-18 08:01:00.0
SMT solder joint quality and appearance inspection process
Industry News | 2016-08-23 16:25:55.0
The SMTA and Chip Scale Review magazine are pleased to announce the Workshops for the 13th Annual International Wafer-Level Packaging Conference (IWLPC). On Thursday, October 20, there will be professional workshops given by instructors who are pre-eminent authorities in their fields. IWLPC will be held October 18-20, 2016 at the DoubleTree Airport Hotel in San Jose, California.
Industry News | 2001-11-27 13:09:48.0
IPC has announced its tutorial and workshop schedule for IPC Printed Circuits Expo 2002. A total of 34 courses are scheduled, including 15 full-day tutorials on March 24-25, and 19 half-day workshops, which will take place on March 25 and 28.
Industry News | 2010-04-28 18:06:35.0
GAINESVILLE, GA ― Count On Toos Inc., a leading provider of precision components and SMT spare parts, introduces its new MYDATA Hydra replacement nozzles and consumables.
Industry News | 2010-08-25 14:54:48.0
Industry experts will shine the spotlight on recent revisions to key electronics manufacturing industry standards and guidelines during IPC’s professional development program at Electronics Midwest. On September 27 and September 29–30, half-day, in-depth workshops will address major updates to the standards that establish electronics manufacturing requirements and acceptability criteria worldwide. In addition, a workshop covering industry best practices, new and emerging developments and future trends in materials and processes for packaging and assembly will be offered.
Industry News | 2012-03-07 19:35:54.0
IPC announces the election of Douglas Pauls, principal materials and process engineer, Rockwell Collins, to chair the IPC Technical Activities Executive Committee (TAEC) for a two-year term. Elected to the position by the chairs and co-chairs of all IPC standards groups, Pauls succeeds Mel Parrish of STI Electronics, Inc. who held the role for IPC’s top standards development oversight committee for the past two years.
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