Industry News | 2003-04-21 10:09:08.0
New Sales, Marketing Channel for Emerging EDA Companies
Industry News | 2003-05-28 08:28:54.0
For June 2-4 (Mon. - Wed.)Design Automation Conference 2003
Industry News | 2010-10-30 01:11:30.0
With only five months left in its development, the 2011 IPC International Technology Roadmap for Electronic Interconnections is paving its way to being the most controversial roadmap to date.
Industry News | 2012-03-07 19:35:54.0
IPC announces the election of Douglas Pauls, principal materials and process engineer, Rockwell Collins, to chair the IPC Technical Activities Executive Committee (TAEC) for a two-year term. Elected to the position by the chairs and co-chairs of all IPC standards groups, Pauls succeeds Mel Parrish of STI Electronics, Inc. who held the role for IPC’s top standards development oversight committee for the past two years.
Industry News | 2012-03-22 19:12:37.0
The long-awaited 2011 IPC International Technology Roadmap for Electronic Interconnections was released last month at IPC APEX EXPO® 2012. Published biennially, the IPC Roadmap serves as an authoritative guide to interconnect technological trends, providing a vision of imminent, innovative technology.
Industry News | 2016-08-13 19:54:46.0
JTAG Technologies return to SMTA in 2016 to premiere several new hardware products for PCB testing and In-System [Device] Programming.
Industry News | 2011-03-10 05:31:30.0
GOEPEL electronic announces the market introduction of another feature within the frame of the emulation technology VarioTAP®. The new option enables the utilisation of fast process-oriented communication interfaces such as LAN or USB2.0 for data transfer, in particular solving the throughput problem in programming massive Flash images.
Industry News | 2011-07-13 13:57:12.0
GOEPEL electronic has developed special VarioTAP® IPs for testing the new generation femtocell chips in cooperation with Picochip. The solution enables dynamic processor emulation tests (PET) for fault detection and diagnostic on board and system level, as well as supporting embedded Flash programming.
Industry News | 2016-05-05 20:15:12.0
Akrometrix today announced that the company released its next-generation Convection Reflow Emulation Module (CRE6) for warpage metrology.
Industry News | 2008-04-01 21:08:46.0
�Master support for Atom joins ASSET's ScanWorks� support for Intel�s
