Industry News | 2003-10-23 13:09:15.0
Parvus� 2320 Series CPU offers low-cost 266MHz single board computer ideal for aerospace, industrial, and transportation systems
Industry News | 2004-01-07 12:08:02.0
at The NAMM Show
Industry News | 2004-06-23 10:54:01.0
Ruggedized embedded computer board to offer extended temperature operation, shock/vibration resistance, and low power consumption for demanding embedded systems apps
Industry News | 2004-10-28 12:03:52.0
Anadigm� Delivers Flexible Subwoofer Solution with New SonicMaster� Programmable Analog ICs
Industry News | 2008-03-19 12:02:59.0
Agilent Technologies Inc. (NYSE: A) today introduced an RF switch platform designed to simplify the task of defining and building a custom switch matrix. The Agilent L4490A/91A RF switch platform allows R&D and manufacturing engineers to cut their RF switch development time by up to 50 percent.
Industry News | 2010-11-16 12:27:02.0
Turck Deléémont is investing in two state-of-the-art SIPLACE machines from the successful X-Series to get ready for the rising order volume at its location in Delémont, Switzerland.
Industry News | 2014-11-05 04:10:04.0
Innodisk proudly announces its presentation of the latest storage appliance and server flash storage on November 4-6 at Cloud Expo in Santa Clara, CA, as well as on November 17-20 at Supercomputing 2014(SC’14) in New Orleans.
Industry News | 2017-11-29 14:28:56.0
Nordson MARCH announces its new-generation RollVIA™ plasma system, a completely self-contained vacuum plasma system with production-proven, roll-to-roll material handling for flexible printed circuit board (PCB) manufacturing. The new RollVIA incorporates unique vacuum and gas flow technology, new process control technology, updated electrode designs, and superior temperature management with precise control of roll speed, tension, and edge guidance for uniform plasma treatment of substrates as thin as 25 microns. The RollVIA system is used for plasma applications such as surface activation for improved adhesion, carbon removal and descum/desmear for cleaner surfaces, and etchback, which removes a slight amount of dielectric contamination between internal copper planes during production of PCBs.
Industry News | 2018-03-07 07:37:28.0
Nordson MARCH announces that it has received a 2018 New Product Introduction (NPI) award in the Surface Treatment category for its new-generation RollVIA™ plasma system. The system is used for plasma applications such as surface activation for improved adhesion, carbon removal and descum/desmear for cleaner surfaces, and etchback, which removes a slight amount of dielectric contamination between internal copper planes during printed circuit board (PCB) production. The RollVIA provides uniform plasma treatment of substrates as thin as 25 microns.
Industry News | 2020-12-21 09:11:22.0
Several Ranges of Miniature Filters with Different Low-pass Configurations were designed to Protect Electronic Equipment from Interferences
