Industry News | 2024-02-26 16:22:08.0
HELLER, a leading provider of reflow soldering equipment, concluded its 2024 Sales Kickoff Meeting in Suwon, South Korea on a high note. The meeting brought together sales representatives from all branches and subsidiaries to discuss the company's unified goals and objectives for the year ahead, and to equip them with the tools and knowledge necessary to achieve success.
Industry News | 2020-11-03 18:16:39.0
2020 Global Surface Mount Technology Company Of The Year Award (Soldering Equipment)
Industry News | 2019-12-09 14:44:26.0
The SMT Reflow Soldering Equipment (Global) award was awarded to Heller Industries by Frost & Sullivan.
Industry News | 2016-07-16 13:32:29.0
Advanced dispense technology is available for integration into your dispensing system. Continuously Volumetric, drip-and-drool free dispense technology can now be retrofitted into your dispense robot. GPD Global's Volumetric PCD pumps ensure the success of applications like underfill, LED encapsulation, solder mask, silicones, conductive ink, conformal coatings, and more. Improve your throughput and yields by retrofitting a Volumetric PCD Pump into your dispense system to simplify the dispense process.
Industry News | 2017-06-14 10:46:29.0
GPD Global offers uniquely designed 2-part mixing pump to accurately mix and dispense two-part components while eliminating entrapped air.
Industry News | 2003-04-29 08:27:33.0
Emerson Energy Systems is using Weidmuller's Minimate S2L/B2L PCB connector for its IMT 2000 multifunction unit, thanks to its space saving design and competitive price.
Industry News | 2020-07-07 13:55:37.0
MIRTEC is pleased to announce that Gentec, a Québec-based design and manufacturing company specializing in rugged and reliable custom-made products and solutions in the fields of high-tech, power and power management electronics, has selected MIRTEC's award-winning MV-3 OMNI Desktop 3D AOI system. The MV-3 OMNI is the perfect 3D Inspection Solution to strengthen Gentec's commitment to uncompromised production quality.
Industry News | 2003-03-31 09:31:11.0
Electronic contract manufacturers face tough realities
Industry News | 2013-11-26 14:46:08.0
The 2013 International Wafer-Level Packaging Conference (IWLPC), organized by SMTA and Chip Scale Review magazine, celebrated its 10th consecutive annual event on November 5-7, 2013 with a very successful conference and exhibition. Technical presentations covered a large range of applications, challenges, and solutions. This 10th anniversary event with over six hundred total participants had thirty-nine presentations in three parallel tracks over the two days.
Industry News | 2009-03-12 18:15:08.0
SMTA Boston will be held April 22-23, 2009 at the Boston Convention Center in conjunction with Electronics New England and NEPCON East.
