Industry News | 2017-07-19 15:29:48.0
The SMTA and Chip Scale Review are pleased to announce the program for the 14th annual International Wafer-Level Packaging Conference. The IWLPC will be held October 24-26, 2017 at the DoubleTree by Hilton Hotel in San Jose, California.
Industry News | 2009-09-28 12:12:32.0
Two-Session Conference to Focus on Green Issues
Industry News | 2012-11-13 09:35:09.0
Comprehensive updates on pressing industry concerns, challenges and developments will be addressed in 50 IPC APEX EXPO® professional development courses, February 17–18 and February 21, 2013, at the San Diego Convention Center.
Industry News | 2020-01-16 16:35:00.0
IPC Design will serve as the pre-eminent international professional network of board designers. At its core will be IPC Design Chapters, localized groups of professionals with board design responsibilities. Members of IPC Design Chapters will be organized around three key goals:
Industry News | 2015-11-01 17:49:33.0
On behalf of IPC – Association Connecting Electronics Industries® and the estimated 800,000 people employed in our 2,200 U.S. member facilities, we congratulate Congressman Paul Ryan (R-WI) on his election to the position of Speaker of the House of Representatives.
Industry News | 2022-08-14 14:18:23.0
The following statement is issued by John Mitchell, IPC president and CEO, to comment on President Biden's signature today on the "CHIPS and Science Act" in Washington, D.C.:
Industry News | 2011-02-05 14:02:52.0
IPC announces its Winter Webinar Series for February and March 2011. Focused on technical challenges facing the electronics manufacturing industry, including lead-free reliability issues, high voltage PCB design, package on package (PoP) assemblies, PoP component manufacturing, thermal cycle testing and barrel failures, the one-hour webinars offer companies a great opportunity to bring IPC technical information to a large number of employees at one time.
Industry News | 2013-11-26 14:46:08.0
The 2013 International Wafer-Level Packaging Conference (IWLPC), organized by SMTA and Chip Scale Review magazine, celebrated its 10th consecutive annual event on November 5-7, 2013 with a very successful conference and exhibition. Technical presentations covered a large range of applications, challenges, and solutions. This 10th anniversary event with over six hundred total participants had thirty-nine presentations in three parallel tracks over the two days.
Industry News | 2022-03-29 07:11:31.0
IPC is now accepting abstracts for technical paper presentations, technical posters, and professional development courses for IPC APEX EXPO 2023. The technical conference will be held January 21-26, 2023, and professional development courses will take place January 24-26, 2023, at the San Diego Convention Center in San Diego.
Industry News | 2017-07-27 19:01:34.0
The SMTA and Chip Scale Review are pleased to announce the Keynote Presenters for the 14th annual International Wafer-Level Packaging Conference. The IWLPC will be held October 24-26, 2017 at the DoubleTree by Hilton Hotel in San Jose, California.
