Industry News | 2018-01-24 22:13:50.0
Kurtz Ersa North America today announced plans to exhibit in Booth #1337 at the 2018 IPC APEX EXPO, scheduled to take place Feb. 27 - March 1, 2018 at the San Diego Convention Center in Ca. The Ersa team will highlight a lineup of advanced reflow, selective solder and rework equipment, including its VERSAPRINT 2 Ultra stencil printer, VERSAFLEX-Ultra selective solder module and IR/PL 650 XL rework system.
Industry News | 2019-08-28 00:00:21.0
Saki Corporation will exhibit its 2Di-LU1 2D bottom-side automated optical inspection (AOI) system at NEPCON Asia along with its 3D AOI and solder paste inspection (SPI) systems and M2M capabilities for ensuring defect-free electronics for automotive and mobile applications. To demonstrate the speed and effectiveness of its 2D bottom-side AOI, Saki is collaborating with Ersa, Wertheim, Germany, to inspect the bottom-side of a printed circuit board assembly (PCBA) after Ersa's SMARTFLOW 2020 selective soldering process.
