Industry News: evs (Page 1 of 17)

Tyco Electronics Names Arrow Electronics 'Distributor Of The Year'

Industry News | 2003-05-15 08:37:06.0

Recognition for helping to extensively grow Tyco Electronics' product sales from 2001 to 2002

SMTnet

IPC E-mobility, Quality & Reliability Advisory Council Members to Speak at Electric and Hybrid Vehicle Tech Expo/The Battery Show North America

Industry News | 2022-08-08 07:06:52.0

A panel featuring members of IPC E-mobility, Quality & Reliability Advisory Council, representing both original equipment manufacturers (OEMs) and their suppliers, will highlight the challenges of building safe, high-quality, and reliable electric vehicles (EVs) and their chargers at the Electric and Hybrid Vehicle Tech Expo and The Battery Show North America on September 14, 2022, in Novi. Mich. Subject matter experts from Stellantis (Centro Ricerche Fiat), FLO EV Charging, Indium, Dow, and Kyzen will present "Building Quality, Reliability & Safety for E-mobility – a Case for EVs and Charging."

Association Connecting Electronics Industries (IPC)

Keynote to Address Electric Vehicles at SMTA International

Industry News | 2021-10-13 13:16:20.0

The SMTA announced Electric Vehicle (EV) analyst and consultant, Loren McDonald, EVAdoption, will keynote the SMTA International Conference and Exposition on Wednesday, November 3, 2021 at 9:00am in the Minneapolis Convention Center in Minneapolis, MN, USA.

Surface Mount Technology Association (SMTA)

New IPC Initiative Focuses on E-mobility Quality & Reliability

Industry News | 2022-05-27 14:34:04.0

From battery fires to non-functional charging stations, from dendrites to poor cable connections, electronic system failures have caused massive recalls. Failures are increasing significantly, not because of quality, but because of usage and implementation of technology. As the expected lifetime usage of parts increases and technology applications change, materials, approaches, and test parameters must change as well.

Association Connecting Electronics Industries (IPC)

International Wafer-Level Packaging Conference (IWLPC) Program Finalized and Registration Now Open

Industry News | 2012-08-02 11:47:58.0

The SMTA and Chip Scale Review magazine are pleased to announce the presentation line-up for the 9th Annual International Wafer-Level Packaging Conference.

Surface Mount Technology Association (SMTA)

SMTA Announces IWLPC 2010 Featured Tutorials

Industry News | 2010-08-17 14:08:36.0

The SMTA and Chip Scale Review magazine are pleased to announce six half-day tutorials for the 7th Annual International Wafer-Level Packaging Conference.

Surface Mount Technology Association (SMTA)

Peter Ramm, Fraunhofer EMFT, to Give Opening Presentation at International Wafer-Level Packaging Conference (IWLPC)

Industry News | 2010-09-02 11:07:09.0

The SMTA and Chip Scale Review magazine are pleased to announce Peter Ramm, Fraunhofer EMFT, as the Opening Speaker at the 7th Annual International Wafer-Level Packaging Conference. The IWLPC will be held October 11-14, 2010 at the Santa Clara Marriott Hotel in Santa Clara, California.

Surface Mount Technology Association (SMTA)

International Wafer-Level Packaging Conference (IWLPC) Concludes Successfully

Industry News | 2010-10-20 21:21:00.0

The SMTA and Chip Scale Review magazine are pleased to announce the 7th Annual International Wafer-Level Packaging Conference and Exhibition was a resounding success. The IWLPC was held October 11-14, 2010 at the Santa Clara Marriott Hotel in Santa Clara, California.

Surface Mount Technology Association (SMTA)

International Wafer-Level Packaging Conference (IWLPC) Concludes Successfully

Industry News | 2011-11-08 15:31:27.0

The SMTA and Chip Scale Review magazine are pleased to announce the 8th Annual International Wafer-Level Packaging Conference and Exhibition was a resounding success.

Surface Mount Technology Association (SMTA)

IWLPC Best Papers Announced

Industry News | 2015-01-15 19:44:09.0

SMTA and Chip Scale Review magazine announced the best papers from the 2014 International Wafer-Level Packaging Conference (IWLPC.) Winners were selected from each of the three tracks covering Wafer Level Packaging, 3-D (Stacked) Packaging, and MEMS Packaging, as well as an overall Best Paper and Best of Conference winner. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging.

Surface Mount Technology Association (SMTA)

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