Industry News | 2021-12-21 14:47:13.0
The SMTA is pleased to announce the technical program for the Wafer-Level Packaging Symposium (WLPS). The symposium will be held February 15-17, 2022 at the DoubleTree by Hilton Hotel in San Jose, California.
Industry News | 2019-07-16 19:36:51.0
The Surface Mount Technology Association (SMTA) and Chip Scale Review are pleased to announce the program for the 16th annual International Wafer-Level Packaging Conference (IWLPC). The conference will be held October 22-24, 2019 at the DoubleTree by Hilton Hotel in San Jose, California.
Industry News | 2018-10-18 10:43:28.0
Suggested 14 and 16 Layer Board Layouts
Industry News | 2015-08-16 09:43:18.0
The SMTA and Chip Scale Review magazine are pleased to announce the presentation line-up for the 12th Annual International Wafer-Level Packaging Conference. The IWLPC will be held October 13-15, 2015 at the DoubleTree Airport Hotel in San Jose, California. Registration is now available online and Early Bird conference pricing is in effect until September 25, 2015, after which registration prices will go up $100.
Industry News | 2017-06-08 15:11:11.0
The SMTA is pleased to announce that the program for the SMTA International Conference and Exhibition is finalized and available on-line at www.smta.org/smtai and registration is open. Taking place September 17-21, 2017 at the Donald Stephens Convention Center in Rosemont, Illinois, the conference features 20 workshops, 130 technical papers, and numerous complimentary offerings for engineers and professionals in the electronics manufacturing industry.
Industry News | 2018-07-26 18:53:00.0
Nordson ASYMTEK a Nordson company announces an automated coating inspection (ACI) line combining its Select Coat® SL-940 Conformal Coating system with the FX-940UV Series ACI/AOI Automated Conformal Coat Inspection system. Together, the systems ensure a conformal coating process that's accurate and reliable, and delivers ongoing coating quality and consistency.
Industry News | 2017-07-19 15:29:48.0
The SMTA and Chip Scale Review are pleased to announce the program for the 14th annual International Wafer-Level Packaging Conference. The IWLPC will be held October 24-26, 2017 at the DoubleTree by Hilton Hotel in San Jose, California.
Industry News | 2012-01-22 23:16:58.0
More than 350 engineers who attended last week’s IPC webinar, Soldering and Assembly Defects, were polled on their biggest headaches with printed boards, PCB components and PCB assembly process failures. The survey results which identify solder finish, ball grid array (BGA) components and reflow soldering as the greatest challenges, provide webinar co-sponsor, National Physical Laboratory (NPL) of the United Kingdom with useful information as it prepares its NPL Process Defect Clinic for IPC APEX EXPO® 2012.
Industry News | 2012-08-02 11:47:58.0
The SMTA and Chip Scale Review magazine are pleased to announce the presentation line-up for the 9th Annual International Wafer-Level Packaging Conference.
Industry News | 2013-04-15 15:41:10.0
Nordson ASYMTEK will demonstrate its SelectCoat® SL-940E conformal coating system with dual applicators as well as a surface mount adhesive dispensing platform at SMT Hybrid Packaging, Nuremberg, smartTec GmbH stand #7-219.
