Industry News | 2018-10-18 09:06:41.0
Gold Fingers: A Guide to Understanding Gold-Plated PCB Connectors
Industry News | 2021-03-02 14:47:04.0
Eutect GmbH further developed and optimized its Sensitive Wire Feeder (SWF). The world's only patented intelligent wire feeder can be used in conjunction with a laser, iron or induction system for soldering assemblies. As part of its continuous product development, the Swabian soldering specialist is now presenting a new development version of the successful product.
Industry News | 2009-03-10 00:30:31.0
Siemens Electronics Assembly Systems will introduce the Siplace X-Series powered by the new Siplace CPP MultiStar placement head at APEX 2009 in Booth #1458. The new Siplace X-Series powered by Siplace MultiStar delivers the ideal combination of chip shooting speed along with extensive component range capability required for flexible end of line placement. This �all-in-one� solution, called Collect & Pick & Place (CPP) enables electronics manufacturers to simplify line setup and programming, eliminate the need for line reconfiguration or head changes, and ensures optimal line balancing for higher productivity and lower operational costs.
Industry News | 2009-05-06 14:53:51.0
With the SIPLACE SX, Munich-based technology leader Siemens Electronics Assembly Systems (SEAS) introduces a placement machine that opens the door to totally new manufacturing concepts and delivers significantly more efficiency in response to increasingly frequent product changeovers and massive demand fluctuations.
Industry News | 2006-02-23 10:25:26.0
The placement machine platform from Siemens Electronics Assembly Systems - the SIPLACE X-Series - was recognized by SMT magazine for innovation and excellence at the APEX/IPC Printed Circuits Expo.
Industry News | 2011-11-08 15:15:40.0
MYDATA is introducing a new Agilis Flex feeder solution for larger components, which extends the reach of its proprietary Agilis feeder technology.
Industry News | 2009-05-29 12:32:19.0
SIPLACE reference lines equipped with the new MultiStar CPP head deliver a continuous high level of line productivity, especially in high-mix production environments.
Industry News | 2009-03-19 15:44:30.0
With its SIPLACE MultiStar, Siemens Electronics Assembly Systems presents the world's first placement head that automatically adapts to nearly all requirements and products in electronics manufacturing. By using different placement modes, the SIPLACE MultiStar balances production lines automatically. It is the first head that combines the speed of Collect & Place operation for small components (01005 and larger) with the versatility of Pick & Place operation for larger components (up to 50 x 40 mm).
Industry News | 2011-03-21 10:39:09.0
Universal Instruments is embracing the convergence era of electronics assembly with the introduction of the Innova and Innova + direct die feeders. This revolutionary technology enables the presentation of wafer-level devices to Universal's GenesisSC Platform without incurring costly packaging charges.
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