Industry News | 2013-05-29 16:43:31.0
FCT Assembly today announced that its representative Production Automation Corp (PAC) closed a new solder paste account for FCT in Southern California.
Industry News | 2003-06-13 10:10:58.0
By combining PacTech's electroless under bump metallization (UBM) processing with DEK's advanced mass imaging systems to create the solder bumps, users can implement a wafer-level, SMT-compatible flip chip assembly process.
Industry News | 2011-09-26 17:08:51.0
FCT Assembly announces the appointment of PacWest Technical Sales, LLC as its representative as part of its strategic effort to increase its sales and service support throughout WA, OR, ID, UT and British Columbia.
Industry News | 2010-01-19 13:47:38.0
January 2010 — The Balver Zinn Group announces that Cobar Europe BV will exhibit a complete range of advanced soldering materials from bar solder to SMT solder paste to high-performance fluxes at the upcoming Pan Pacific Microelectronics Symposium & Tabletop Exhibition, scheduled to take place January 26-28, 2010 at the Sheraton Kauai Resort, on Kauai, Hawaii.
Industry News | 2011-03-28 11:42:40.0
Lattice Semiconductor Corporation (NASDAQ: LSCC) today announced the immediate availability of three new low cost I/O Breakout Boards: the MachXO™ 2280 Breakout Board, the ispMACH® 4256ZE Breakout Board and the Power Manager II POWR1014A Breakout Board.
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