Industry News: flat belt board transfer (Page 1 of 6)

Camtek Introduces the Dragon, a New, Fast AOI System with Fully-automated Material Handling

Industry News | 2003-03-25 09:15:19.0

The Dragon was demonstrated at the CPCA show in Shanghai last week

SMTnet

IPC RELEASES NEW REVISION OF SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD

Industry News | 2010-07-22 22:37:02.0

IPC — Association Connecting Electronics Industries® has released the B revision of IPC-7351, Generic Requirements for Surface Mount Design and Land Pattern Standard. The leading industry standard for surface mount land pattern design and layout, IPC-7351B provides designers and printed board fabricators with updated guidance on requirements of land pattern geometries used for the surface attachment of electronic components, as well as surface mount design recommendations for achieving the best possible solder joints.

Association Connecting Electronics Industries (IPC)

Nordson ASYMTEK's Select Coat SC-280 Film Coater Improves Material Utilization by 30 to 50 Percent in Conformal Coating Applications

Industry News | 2011-05-06 22:30:34.0

Nordson ASYMTEK introduces its new film coater for automated, selective, and precision application of conformal coating materials. The Nordson ASYMTEK Select Coat® SC-280 provides greater than 99 percent fluid transfer efficiency, improving material utilization by 30 to 50 percent.

ASYMTEK Products | Nordson Electronics Solutions

Count On Tools Inc. Introduces SwissGrip ESD Screwdrivers by PB Swiss Tools

Industry News | 2015-03-24 10:48:06.0

Count On Tools announces that PB Swiss Tools has expanded its existing ESD Screwdriver selection with firmly mounted blades. SwissGrip ESD Screwdrivers are ideal even for difficult applications, with adjusted handle ergonomics. The expanded series is available for Slotted/Flat, Phillips, Pozidriv, Hex Bolts (socket wrench), Hex socket (allen key) and Torx ® screw profiles.

Count On Tools, Inc.

Guidelines for Design and Assembly Process Implementation for Bottom Termination Components Released by IPC

Industry News | 2011-05-03 22:50:52.0

Assemblers who have tried to resolve problems that stem from the rapidly growing array of advanced packages are getting some help from IPC with the newly released IPC-7093, Design and Assembly Process Implementation for Bottom Termination Components. This standard describes the critical design, assembly, inspection, repair, and reliability issues associated with bottom termination components (BTCs) whose external connections consist of metallized terminals that are an integral part of the component body.

Association Connecting Electronics Industries (IPC)

Basics of Control Impedance

Industry News | 2018-10-18 11:16:22.0

Basics of Control Impedance

Flason Electronic Co.,limited

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Industry News | 2018-12-08 03:29:29.0

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Flason Electronic Co.,limited

VOLUNTEERS HONORED FOR CONTRIBUTIONS TO ELECTRONICS INDUSTRY AND IPC More than 150 awards presented at IPC APEX EXPO 2014

Industry News | 2014-03-28 09:54:48.0

IPC – Association Connecting Electronics Industries® presented Committee Leadership, Distinguished Committee Service and Special Recognition Awards at IPC APEX EXPO® at Mandalay Bay Convention Center in Las Vegas.

Association Connecting Electronics Industries (IPC)

BTU Launches New TrueFlat Technology to End Die Tilt at SEMICON Taiwan

Industry News | 2017-08-26 20:24:13.0

BTU International today announced plans to introduce its new TrueFlat technology, an optional configuration of the PYRAMAX™ convection reflow oven. The unique technology for substrate flatness will be introduced for the first time in Booth 1314 at SEMICON Taiwan, scheduled to take place Sept. 13-15, 2017 at the Taipei Nangang Exhibition Center in Taipei, Taiwan.

BTU International

BTU to Demo TrueFlat Technology for Substrate Flatness at SEMICON China

Industry News | 2018-02-19 13:46:00.0

BTU International will demonstrate its TrueFlat technology in the CohPros International Co., Ltd, booth #N2, 2613 at SEMICON China, scheduled to take place March 14-16, 2018 at the Shanghai New International Expo Centre.

BTU International

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