Industry News: flat pack thermal pad (Page 1 of 3)

IPC RELEASES NEW REVISION OF SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD

Industry News | 2010-07-22 22:37:02.0

IPC — Association Connecting Electronics Industries® has released the B revision of IPC-7351, Generic Requirements for Surface Mount Design and Land Pattern Standard. The leading industry standard for surface mount land pattern design and layout, IPC-7351B provides designers and printed board fabricators with updated guidance on requirements of land pattern geometries used for the surface attachment of electronic components, as well as surface mount design recommendations for achieving the best possible solder joints.

Association Connecting Electronics Industries (IPC)

SMTA International to Address QFN Assembly & Reliability

Industry News | 2011-09-14 12:04:43.0

The SMTA announced a session on QFN Assembly and Reliability will take place on Tuesday, October 18 during their annual conference, SMTA International, in Ft. Worth, Texas. Andrew Mawer of Freescale Semiconductor will chair the session and Viswam Puligandla, Ph.D., Nokia (Retired) will co-chair.

Surface Mount Technology Association (SMTA)

Stencil aperture considerations for QFN chips

Industry News | 2018-10-18 08:40:47.0

Stencil aperture considerations for QFN chips

Flason Electronic Co.,limited

Via in Pad PCB

Industry News | 2018-10-18 10:38:59.0

Via in Pad PCB

Flason Electronic Co.,limited

What is a Ball Grid Array?

Industry News | 2018-10-18 10:22:15.0

What is a Ball Grid Array?

Flason Electronic Co.,limited

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Industry News | 2018-12-08 03:29:29.0

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Flason Electronic Co.,limited

Working with QFNs and QFPs

Industry News | 2018-10-18 09:05:06.0

Working with QFNs and QFPs

Flason Electronic Co.,limited

Fancort Industries to Display Its SMT Product Line at productronica

Industry News | 2015-10-21 17:15:18.0

Fancort Industries, Inc. will exhibit in Hall B2, Booth 389 at the productronica International Trade Fair, scheduled to take place Nov. 10-13, 2015 at the Messe München exhibition center in Munich, Germany. Fancort is a leader in the design and fabrication of lead forming and cutting equipment, primarily for SMDs and some through-hole applications. The company will showcase its wide selection of equipment and services designed to meet all requirements from prototype to moderate production, specializing in processing high-reliability aerospace grade devices to exacting SMT tolerances. Fancort will display its standard line of SMT products, including:

Fancort Industries, Inc.

Practical Components to Debut New Test Board for 0.33 mm Dummy CVBGA Test Vehicle at the IPC APEX Expo

Industry News | 2012-02-03 13:29:38.0

Practical Components will feature its new Amkor PoP stacked packages, including the new TMV PoP, along with its full line of dummy component packages in Booth #538 at the upcoming IPC APEX Expo.

Practical Components, Inc.

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